SCHEMBL516457

SCHEMBL516457

CCCCCC(N)C(CC)CCC

nearest known ligand 0.48

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
OPRM1 P35372 1/20 0.48
CYP2D6 P10635 2/20 0.42
SPHK1 Q9NYA1 2/20 0.42
TP53 P04637 2/20 0.42
LMNA P02545 2/20 0.42
GMNN O75496 1/20 0.42
POLB P06746 1/20 0.42
THPO P40225 1/20 0.42
MTOR P42345 1/20 0.42
BLM P54132 1/20 0.42
KDM4E B2RXH2 1/20 0.42
CYP1A2 P05177 1/20 0.42
CYP3A4 P08684 1/20 0.42
MAPT P10636 1/20 0.42
CETP P11597 1/20 0.42
HTT P42858 1/20 0.42
UBE2N P61088 1/20 0.42
LAP3 P28838 2/20 0.39
PLA2G1B P04054 1/20 0.38
PLA2G2A P14555 1/20 0.38

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL516416 0.93 ALDH1A1 (0.41) OPRM1CYP2D6SPHK1TP53LMNA
SCHEMBL516727 0.90 OPRM1 (0.52) OPRM1CYP2D6SPHK1TP53LMNA
SCHEMBL1237103 0.90 OPRM1 (0.52) OPRM1CYP2D6SPHK1TP53LMNA
SCHEMBL29286431 0.88 OPRM1 (0.46) OPRM1CYP2D6SPHK1TP53LMNA
SCHEMBL29173995 0.88 OPRM1 (0.46) OPRM1CYP2D6SPHK1TP53LMNA
SCHEMBL29286830 0.88 OPRM1 (0.46) OPRM1CYP2D6SPHK1TP53LMNA
SCHEMBL4950681 0.88 OPRM1 (0.46) OPRM1CYP2D6SPHK1TP53LMNA
SCHEMBL4954386 0.88 OPRM1 (0.46) OPRM1CYP2D6SPHK1TP53LMNA
SCHEMBL4946266 0.88 OPRM1 (0.46) OPRM1CYP2D6SPHK1TP53LMNA
SCHEMBL11897821 0.88 OPRM1 (0.50) OPRM1CYP2D6SPHK1TP53LMNA

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 20 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-2738010-A1 RESIN COMPOSITION FOR LASER ENGRAVING, RELIEF PRINTING PLATE PRECURSOR FOR LASER ENGRAVING, PROCESS FOR PRODUCING RELIEF PRINTING PLATE PRECURSOR FOR LASER ENGRAVING, PROCESS FOR PRODUCING RELIEF PRINTING PLATE, AND RELIEF PRINTING PLATE FUJIFILM Corporation (JP) 2014-06-04 EP disclosed
EP-2481583-B1 Resin composition for laser engraving, relief printing plate precursor for laser engraving, and relief printing plate and process for making the same FUJIFILM CORP (JP) 2014-05-28 EP disclosed
US-20140130693-A1 RESIN COMPOSITION FOR LASER ENGRAVING, RELIEF PRINTING PLATE PRECURSOR FOR LASER ENGRAVING, PROCESS FOR PRODUCING RELIEF PRINTING PLATE PRECURSOR FOR LASER ENGRAVING, PROCESS FOR MAKING RELIEF PRINTING PLATE, AND RELIEF PRINTING PLATE FUJIFILM CORPORATION (JP) 2014-05-15 US disclosed
EP-2393666-B1 RELIEF PRINTING PLATE FUJIFILM CORP (JP) 2014-01-15 EP disclosed
US-8618208-B2 Resin composition for laser engraving, relief printing plate precursor for laser engraving and process for producing the same, and relief printing plate and process for making the same FUJIFILM CORPORATION (JP) 2013-12-31 US disclosed
US-8541534-B2 Resin composition for laser engraving, relief printing plate precursor for laser engraving, relief printing plate and method for producing relief printing plate FUJIFILM CORPORATION (JP) 2013-09-24 US disclosed
US-20130133537-A1 RESIN COMPOSITION FOR LASER ENGRAVING, FLEXOGRAPHIC PRINTING PLATE PRECURSOR FOR LASER ENGRAVING AND PROCESS FOR PRODUCING SAME, AND FLEXOGRAPHIC PRINTING PLATE AND PROCESS FOR MAKING SAME FUJIFILM CORPORATION (JP) 2013-05-30 US disclosed
EP-2565046-A2 Resin composition for laser engraving, relief printing plate precursor for laser engraving and process for producing same, process for making relief printing plate, and relief printing plate Fujifilm Corporation (JP) 2013-03-06 EP disclosed
US-20130047878-A1 RESIN COMPOSITION FOR LASER ENGRAVING, RELIEF PRINTING PLATE PRECURSOR FOR LASER ENGRAVING AND PROCESS FOR PRODUCING SAME, PROCESS FOR MAKING RELIEF PRINTING PLATE, AND RELIEF PRINTING PLATE FUJIFILM CORPORATION (JP) 2013-02-28 US disclosed
EP-2301750-B1 Resin composition for laser engraving, relief printing starting plate for laser engraving and process for producing the same FUJIFILM CORP (JP) 2012-10-31 EP disclosed
US-20120192737-A1 RESIN COMPOSITION FOR LASER ENGRAVING, RELIEF PRINTING PLATE PRECURSOR FOR LASER ENGRAVING, AND RELIEF PRINTING PLATE AND PROCESS FOR MAKING THE SAME FUJIFILM CORPORATION (JP) 2012-08-02 US disclosed
EP-2481583-A2 Resin composition for laser engraving, relief printing plate precursor for laser engraving, and relief printing plate and process for making the same Fujifilm Corporation (JP) 2012-08-01 EP disclosed
US-20120146264-A1 RESIN COMPOSITION FOR LASER ENGRAVING, RELIEF PRINTING PLATE PRECURSOR FOR LASER ENGRAVING AND PROCESS FOR PRODUCING SAME, AND PROCESS FOR MAKING RELIEF PRINTING PLATE FUJIFILM CORPORATION (JP) 2012-06-14 US disclosed
US-20120135196-A1 RESIN COMPOSITION FOR LASER ENGRAVING, RELIEF PRINTING PLATE PRECURSOR FOR LASER ENGRAVING AND PROCESS FOR PRODUCING THE SAME, AND RELIEF PRINTING PLATE AND PROCESS FOR MAKING THE SAME FUJIFILM CORPORATION (JP) 2012-05-31 US disclosed
US-20120024224-A1 RESIN COMPOSITION FOR LASER ENGRAVING, RELIEF PRINTING PLATE PRECURSOR FOR LASER ENGRAVING AND PROCESS FOR PRODUCING THE SAME, AND RELIEF PRINTING PLATE AND PROCESS FOR MAKING THE SAME FUJIFILM CORPORATION (JP) 2012-02-02 US disclosed
US-20110076454-A1 RESIN COMPOSITION FOR LASER ENGRAVING, RELIEF PRINTING STARTING PLATE FOR LASER ENGRAVING AND PROCESS FOR PRODUCING SAME, AND RELIEF PRINTING PLATE AND PROCESS FOR MAKING SAME FUJIFILM CORPORATION (JP) 2011-03-31 US disclosed
EP-2301750-A1 Resin composition for laser engraving, relief printing starting plate for laser engraving and process for producing the same Fujifilm Corporation (JP) 2011-03-30 EP disclosed
WO-2010090345-A1 RESIN COMPOSITION FOR LASER ENGRAVING, RELIEF PRINTING PLATE PRECURSOR FOR LASER ENGRAVING, RELIEF PRINTING PLATE AND METHOD FOR PRODUCING RELIEF PRINTING PLATE FUJIFILM CORPORATION (JP) 2010-08-12 WO disclosed
EP-0206621-B1 PROCESS FOR DISPROPORTIONATING SILANES MITSUI TOATSU CHEMICALS, Inc. (JP) 1989-11-15 EP disclosed
EP-0206621-A1 Process for disproportionating silanes MITSUI TOATSU CHEMICALS, Inc. (JP) 1986-12-30 EP disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (1 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-20120146264-A1 RESIN COMPOSITION FOR LASER ENGRAVING, RELIEF PRINTING PLATE PRECURSOR FOR LASER ENGRAVING AND PROCESS FOR PRODUCING SAME, AND PROCESS FOR MAKING RELIEF PRINTING PLATE EIF3L, EIF2B1, EIF2B5 OPRM1 2022/4885CYP2D6 4405/4885SPHK1 1024/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.