SCHEMBL516676

SCHEMBL516676

NCC=C(Cc1ccccc1)Cc1ccccc1

nearest known ligand 0.44

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
CES1 P23141 2/20 0.44
CES2 O00748 1/20 0.44
AKR1B1 P15121 1/20 0.44
LOXL2 Q9Y4K0 2/20 0.44
HTR2A P28223 2/20 0.41
CYP2A6 P11509 1/20 0.41
SMN1; SMN2 Q16637 1/20 0.41
TAAR1 Q96RJ0 1/20 0.41
AOC3 Q16853 2/20 0.40
MAOB P27338 1/20 0.40
MEN1 O00255 1/20 0.39
KMT2A Q03164 1/20 0.39
HDAC8 Q9BY41 1/20 0.39
HDAC6 Q9UBN7 1/20 0.39
TSHR P16473 1/20 0.39
CYP3A4 P08684 1/20 0.38
CYP2C9 P11712 1/20 0.38
BTN3A1 O00481 1/20 0.38
FNTA P49354 1/20 0.38
FNTB P49356 1/20 0.38

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL27136057 0.80 CES2 (0.43) CES1CES2AKR1B1LOXL2HTR2A
SCHEMBL11277665 0.79 CES1 (0.46) CES1CES2AKR1B1MAOBMEN1
SCHEMBL9631890 0.79 MAOB (0.50) CES1CES2AKR1B1MAOBMEN1
SCHEMBL563812 0.78 CES2 (0.41) CES1CES2AKR1B1LOXL2HTR2A
SCHEMBL27913022 0.77 CES1 (0.44) CES1CES2AKR1B1MAOBMEN1
SCHEMBL8668128 0.77 CES1 (0.44) CES1CES2AKR1B1MAOBMEN1
SCHEMBL516687 0.76 CES1 (0.48) CES1CES2AKR1B1LOXL2HTR2A
Bromide SCHEMBL11619427 0.76 CES1 (0.43) CES1CES2AKR1B1MAOBMEN1
SCHEMBL27285244 0.75 CYP3A4 (0.59) CES1CES2AKR1B1MEN1KMT2A
SCHEMBL10722411 0.74 AOC2 (0.55) CES1CES2AKR1B1LOXL2HTR2A

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 26 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-107641174-B Copper (II) ion surface imprinted polymer with double exchange of anions and cations and preparation method thereof 淮海工学院 2021-03-12 CN claimed
US-6046326-A REACTING ETHYLENE CARBONATE AND ISOCYANURIC ACID USING HETEROCYCLIC AMINE CATALYST ESSEX GROUP (US) 2000-04-04 US claimed
CN-107641174-B Copper (II) ion surface imprinted polymer with double exchange of anions and cations and preparation method thereof 淮海工学院 2021-03-12 CN disclosed
EP-2738010-A1 RESIN COMPOSITION FOR LASER ENGRAVING, RELIEF PRINTING PLATE PRECURSOR FOR LASER ENGRAVING, PROCESS FOR PRODUCING RELIEF PRINTING PLATE PRECURSOR FOR LASER ENGRAVING, PROCESS FOR PRODUCING RELIEF PRINTING PLATE, AND RELIEF PRINTING PLATE FUJIFILM Corporation (JP) 2014-06-04 EP disclosed
EP-2481583-B1 Resin composition for laser engraving, relief printing plate precursor for laser engraving, and relief printing plate and process for making the same FUJIFILM CORP (JP) 2014-05-28 EP disclosed
US-20140130693-A1 RESIN COMPOSITION FOR LASER ENGRAVING, RELIEF PRINTING PLATE PRECURSOR FOR LASER ENGRAVING, PROCESS FOR PRODUCING RELIEF PRINTING PLATE PRECURSOR FOR LASER ENGRAVING, PROCESS FOR MAKING RELIEF PRINTING PLATE, AND RELIEF PRINTING PLATE FUJIFILM CORPORATION (JP) 2014-05-15 US disclosed
EP-2393666-B1 RELIEF PRINTING PLATE FUJIFILM CORP (JP) 2014-01-15 EP disclosed
US-8618208-B2 Resin composition for laser engraving, relief printing plate precursor for laser engraving and process for producing the same, and relief printing plate and process for making the same FUJIFILM CORPORATION (JP) 2013-12-31 US disclosed
US-8541534-B2 Resin composition for laser engraving, relief printing plate precursor for laser engraving, relief printing plate and method for producing relief printing plate FUJIFILM CORPORATION (JP) 2013-09-24 US disclosed
US-20130133537-A1 RESIN COMPOSITION FOR LASER ENGRAVING, FLEXOGRAPHIC PRINTING PLATE PRECURSOR FOR LASER ENGRAVING AND PROCESS FOR PRODUCING SAME, AND FLEXOGRAPHIC PRINTING PLATE AND PROCESS FOR MAKING SAME FUJIFILM CORPORATION (JP) 2013-05-30 US disclosed
EP-2565046-A2 Resin composition for laser engraving, relief printing plate precursor for laser engraving and process for producing same, process for making relief printing plate, and relief printing plate Fujifilm Corporation (JP) 2013-03-06 EP disclosed
US-20120024224-A1 RESIN COMPOSITION FOR LASER ENGRAVING, RELIEF PRINTING PLATE PRECURSOR FOR LASER ENGRAVING AND PROCESS FOR PRODUCING THE SAME, AND RELIEF PRINTING PLATE AND PROCESS FOR MAKING THE SAME FUJIFILM CORPORATION (JP) 2012-02-02 US disclosed
US-20110076454-A1 RESIN COMPOSITION FOR LASER ENGRAVING, RELIEF PRINTING STARTING PLATE FOR LASER ENGRAVING AND PROCESS FOR PRODUCING SAME, AND RELIEF PRINTING PLATE AND PROCESS FOR MAKING SAME FUJIFILM CORPORATION (JP) 2011-03-31 US disclosed
EP-2301750-A1 Resin composition for laser engraving, relief printing starting plate for laser engraving and process for producing the same Fujifilm Corporation (JP) 2011-03-30 EP disclosed
WO-2010090345-A1 RESIN COMPOSITION FOR LASER ENGRAVING, RELIEF PRINTING PLATE PRECURSOR FOR LASER ENGRAVING, RELIEF PRINTING PLATE AND METHOD FOR PRODUCING RELIEF PRINTING PLATE FUJIFILM CORPORATION (JP) 2010-08-12 WO disclosed
US-7700800-B2 Method for producing fluorine-containing alkyl (meth)acrylate TOKUYAMA CORPORATION (JP) 2010-04-20 US disclosed
US-20090023948-A1 Method for Producing Fluorine-Containing Alkyl (Meth)Acrylate TOKUYAMA CORPORATION (JP) 2009-01-22 US disclosed
EP-0206621-B1 PROCESS FOR DISPROPORTIONATING SILANES MITSUI TOATSU CHEMICALS, Inc. (JP) 1989-11-15 EP disclosed
EP-0206621-A1 Process for disproportionating silanes MITSUI TOATSU CHEMICALS, Inc. (JP) 1986-12-30 EP disclosed
US-3966594-A SOLVENT EXTRACTION WITH TERTIERY AMINE AND ALKALI SUMITOMO CHEMICAL COMPANY, LIMITED (JA) 1976-06-29 US disclosed