SCHEMBL516924

SCHEMBL516924

C=C(C)C(=O)OC(CN=C=O)N=C=O

nearest known ligand 0.34

Predicted protein targets (top 2)

geneUniProtsupporting neighboursconfidence
TSHR P16473 1/20 0.34
ALDH1A1 P00352 1/20 0.32

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL1574087 0.91 THRB (0.37) TSHRALDH1A1
SCHEMBL814047 0.83 TSHR (0.36) TSHRALDH1A1
SCHEMBL5574536 0.83 TSHR (0.36) TSHRALDH1A1
SCHEMBL5161744 0.81 TSHR (0.31) TSHR
SCHEMBL1850276 0.80 TSHR (0.34) TSHRALDH1A1
SCHEMBL5177573 0.80 TSHR (0.50) TSHRALDH1A1
SCHEMBL4612822 0.80 ALDH1A1 (0.36) TSHRALDH1A1
SCHEMBL10341243 0.79 TSHR (0.36) TSHRALDH1A1
SCHEMBL322300 0.79 TSHR (0.40) TSHRALDH1A1
SCHEMBL27842087 0.79 NOS2 (0.31) TSHR

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 54 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
JP-11043501-A None JP disclosed
CN-104144962-B Reduce the hydrophobicity of protein adsorption and the copolymer of hydrophilic segment BVW控股公司 2017-03-08 CN disclosed
EP-1880843-B1 Pressure-sensitive adhesive sheet for use in dicing NITTO DENKO CORP (JP) 2014-11-19 EP disclosed
US-8652938-B2 Thermally releasable sheet-integrated film for semiconductor back surface, method of collecting semiconductor element, and method of producing semiconductor device NITTO DENKO CORPORATION (JP) 2014-02-18 US disclosed
US-20130260120-A1 HEAT-PEELABLE PRESSURE-SENSITIVE ADHESIVE SHEET NITTO DENKO CORPORATION (JP) 2013-10-03 US disclosed
EP-2644669-A1 Heat-peelable pressure-sensitive adhesive sheet NITTO DENKO CORPORATION (JP) 2013-10-02 EP disclosed
EP-2634228-A2 Self-rolling adhesive film NITTO DENKO CORPORATION (JP) 2013-09-04 EP disclosed
EP-2634229-A2 Self-rolling adhesive film NITTO DENKO CORPORATION (JP) 2013-09-04 EP disclosed
US-20130224418-A1 SELF-ROLLING ADHESIVE FILM NITTO DENKO CORPORATION (JP) 2013-08-29 US disclosed
US-20130220532-A1 SELF-ROLLING ADHESIVE FILM NITTO DENKO CORPORATION (JP) 2013-08-29 US disclosed
EP-1640396-A1 CURING RESIN COMPOSITION, SEALING MATERIAL FOR LIQUID CRYSTAL DISPLAY DEVICE AND LIQUID CRYSTAL DISPLAY DEVICE SEKISUI CHEMICAL CO., LTD. (JP) 2006-03-29 EP disclosed
CN-1609158-A Thermally releasable double-sided pressure-sensitive adhesive sheet, method for treating adherend, and electronic component NITTO DENKO CORP (JP) 2005-04-27 CN disclosed
US-20050031861-A1 Re-peelable pressure-sensitive adhesive sheet NITTO DENKO CORPORATION (JP) 2005-02-10 US disclosed
EP-1464688-A1 Heat-peelable double-faced pressure-sensitive adhesive sheet, method for adhering processed material onto said sheet, and electronic part NITTO DENKO CORPORATION (JP) 2004-10-06 EP disclosed
US-20040191510-A1 Heat-peelable double-faced pressure-sensitive adhesive sheet, method of processing adherend, and electronic part NITTO DENKO CORPORATION 2004-09-30 US disclosed
EP-1354925-A1 Heat-peelable pressure-sensitive adhesive sheet for electronic part, method of processing electronic part, and electronic part NITTO DENKO CORPORATION (JP) 2003-10-22 EP disclosed
US-20020192463-A1 Heat-peelable pressure-sensitive adhesive sheet NITTO DENKO CORPORATION 2002-12-19 US disclosed
US-6054545-A CELLULOSE MODIFIED WITH CARBOXYLATED ISOCYANATE TOKYO OHKA KOGYO CO., LTD. (JP) 2000-04-25 US disclosed
JP-H1143501-A MODIFIED CELLULOSE COMPOUND AND PHOTO POLYMERIZABLE RESIN COMPOSITION CONTAINING THE SAME TOKYO OHKA KOGYO CO LTD 1999-02-16 JP disclosed
EP-0894808-A1 Modified cellulose compound and photopolymerizable resin composition containing the same TOKYO OHKA KOGYO CO., LTD. (JP) 1999-02-03 EP disclosed