SCHEMBL5269742

SCHEMBL5269742

CCC(c1ccc(C=CC(=O)O)cc1)[Si](OC)(OC)OC

nearest known ligand 0.54

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
KDM4E B2RXH2 6/20 0.54
MAPK1 P28482 2/20 0.54
THRB P10828 1/20 0.50
ATM Q13315 1/20 0.50
BCHE P06276 1/20 0.44
ACHE P22303 1/20 0.44
PTGS2 P35354 1/20 0.44
TAS1R3 Q7RTX0 3/20 0.44
TAS1R1 Q7RTX1 3/20 0.44
HCAR2 Q8TDS4 2/20 0.44
ESR1 P03372 2/20 0.44
ESR2 Q92731 2/20 0.44
CA12 O43570 2/20 0.44
CA1 P00915 2/20 0.44
CA2 P00918 2/20 0.44
CA3 P07451 2/20 0.44
PKM P14618 2/20 0.44
CA4 P22748 2/20 0.44
CA6 P23280 2/20 0.44
CA5A P35218 2/20 0.44

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL2010385 0.87 BCHE (0.43) KDM4EMAPK1BCHEACHEPTGS2
SCHEMBL17442501 0.78 CYP17A1 (0.34) ESR1ALOX15PGR
SCHEMBL28223266 0.77 KDM4E (0.66) KDM4EMAPK1THRBATMBCHE
SCHEMBL20032085 0.77 KDM4E (0.66) KDM4EMAPK1THRBATMBCHE
SCHEMBL20238791 0.75 ALDH1A1 (0.38) TAS1R3TAS1R1ALDH1A1HDAC8
SCHEMBL18713537 0.75 KDM4E (0.69) KDM4EMAPK1THRBATMBCHE
SCHEMBL5269733 0.75 KDM4E (0.46) KDM4ECA12CA1CA2CA4
SCHEMBL3857561 0.73 KDM4E (0.66) KDM4EMAPK1THRBATMBCHE
SCHEMBL3858925 0.73 KDM4E (0.66) KDM4EMAPK1THRBATMBCHE
SCHEMBL2232062 0.73 ACHE (0.79) KDM4EMAPK1THRBATMBCHE

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 17 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-0896502-B1 Method of treating metal foil for enhancing adhesion NIKKO MATERIALS USA INC (US) 2007-10-03 EP disclosed
EP-0974685-B1 Method for making a metal foil with improved bonding to substrates GA TEK INC (US) 2003-12-03 EP disclosed
EP-1089866-A4 PROCESS TO PREPARE A POLYMER NANOCOMPOSITE COMPOSITION SOLUTIA INC (US) 2002-09-25 EP disclosed
EP-1214356-A1 METHODS FOR THE PREPARATION OF POLYAMIDE NANOCOMPOSITE COMPOSITIONS BY IN SITU POLYMERIZATION Solutia Inc. (US) 2002-06-19 EP disclosed
EP-1054922-A4 POLYMER NANOCOMPOSITE COMPOSITION SOLUTIA INC (US) 2001-08-08 EP disclosed
EP-1089866-A1 PROCESS TO PREPARE A POLYMER NANOCOMPOSITE COMPOSITION Solutia Inc. (US) 2001-04-11 EP disclosed
EP-1086144-A1 METHODS FOR THE PREPARATION OF POLYAMIDE NANOCOMPOSITE COMPOSITIONS BY IN SITU AND SOLID STATE POLYMERIZATIONS Solutia Inc. (US) 2001-03-28 EP disclosed
WO-2001012678-A1 METHODS FOR THE PREPARATION OF POLYAMIDE NANOCOMPOSITE COMPOSITIONS BY IN SITU POLYMERIZATION SOLUTIA INC. (US) 2001-02-22 WO disclosed
EP-1054922-A1 POLYMER NANOCOMPOSITE COMPOSITION Solutia Inc. (US) 2000-11-29 EP disclosed
US-6086743-A Adhesion enhancement for metal foil GOULD ELECTRONICS, INC. (US) 2000-07-11 US disclosed
WO-2000009571-A1 METHODS FOR THE PREPARATION OF POLYAMIDE NANOCOMPOSITE COMPOSITIONS BY IN SITU AND SOLID STATE POLYMERIZATIONS SOLUTIA INC. (US) 2000-02-24 WO disclosed
EP-0974685-A1 Metal foil with improved bonding to substrates and method for making said foil Gould Electronics Inc. (US) 2000-01-26 EP disclosed
WO-1999041060-A1 PROCESS TO PREPARE A POLYMER NANOCOMPOSITE COMPOSITION SOLUTIA, INC. (US) 1999-08-19 WO disclosed
WO-1999041299-A1 POLYMER NANOCOMPOSITE COMPOSITION SOLUTIA INC. (US) 1999-08-19 WO disclosed
US-5908542-A CONTACTING A METAL FOIL WITH AN ACIDIC SOLUTION; PLACING THE METAL FOIL IN A NICKEL TREATMENT BATH AND APPLYING A CURRENT THROUGH THE NICKEL TREATMENT BATH, WHEREIN THE NICKEL TREATMENT BATH CONTAINS AT LEAST ABOUT TWO PLATING ZONES, GOULD ELECTRONICS INC. (US) 1999-06-01 US disclosed
US-5885436-A Adhesion enhancement for metal foil GOULD ELECTRONICS INC. (US) 1999-03-23 US disclosed
EP-0896502-A1 Method of treating metal foil for enhancing adhesion Gould Electronics Inc. (US) 1999-02-10 EP disclosed