Predicted protein targets (top 19)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | TDP1 | Q9NUW8 | 1/20 | 0.37 |
| ▸ | GABRR1 | P24046 | 2/20 | 0.33 |
| ▸ | SLC22A6 | Q4U2R8 | 1/20 | 0.33 |
| ▸ | LMNA | P02545 | 1/20 | 0.33 |
| ▸ | KDM4E | B2RXH2 | 1/20 | 0.31 |
| ▸ | SMN1; SMN2 | Q16637 | 1/20 | 0.31 |
| ▸ | ALDH1A1 | P00352 | 1/20 | 0.31 |
| ▸ | HMGCR | P04035 | 1/20 | 0.31 |
| ▸ | CHRM1 | P11229 | 1/20 | 0.31 |
| ▸ | TBXA2R | P21731 | 1/20 | 0.31 |
| ▸ | ADRA1A | P35348 | 1/20 | 0.31 |
| ▸ | ANPEP | P15144 | 2/20 | 0.30 |
| ▸ | ENPEP | Q07075 | 2/20 | 0.30 |
| ▸ | S1PR2 | O95136 | 1/20 | 0.30 |
| ▸ | S1PR1 | P21453 | 1/20 | 0.30 |
| ▸ | CYP2D6 | P10635 | 1/20 | 0.30 |
| ▸ | TSHR | P16473 | 1/20 | 0.30 |
| ▸ | CYP2C19 | P33261 | 1/20 | 0.30 |
| ▸ | HIF1A | Q16665 | 1/20 | 0.30 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL5379381 | 0.91 | LMNA (0.34) | TDP1GABRR1LMNAKDM4ESMN1; SMN2 | |
| SCHEMBL10587729 | 0.80 | TDP1 (0.39) | TDP1GABRR1SLC22A6LMNAKDM4E | |
| SCHEMBL5691964 | 0.79 | TDP1 (0.34) | TDP1GABRR1SLC22A6LMNAALDH1A1 | |
| SCHEMBL27739561 | 0.73 | SLC22A6 (0.36) | TDP1GABRR1SLC22A6LMNASMN1; SMN2 | |
| SCHEMBL1964906 | 0.73 | SLC22A6 (0.36) | TDP1GABRR1SLC22A6LMNAKDM4E | |
| SCHEMBL6463849 | 0.73 | SLC22A6 (0.36) | TDP1GABRR1SLC22A6LMNAKDM4E | |
| SCHEMBL288405 | 0.73 | SLC22A6 (0.36) | TDP1GABRR1SLC22A6LMNAKDM4E | |
| SCHEMBL288510 | 0.72 | SLC22A6 (0.50) | TDP1GABRR1SLC22A6LMNASMN1; SMN2 | |
| SCHEMBL16374685 | 0.72 | ALDH1A1 (0.45) | TDP1LMNAKDM4EALDH1A1HMGCR | |
| SCHEMBL8008505 | 0.71 | ALDH1A1 (0.33) | ALDH1A1CYP2D6TSHRCYP2C19HIF1A |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 13 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-20240076541-A1 | RESIN COMPOSITION AND LIGHT-EMITTING DEVICE | NICHIA CORPORATION (JP) | 2024-03-07 | — | — | US | claimed |
| EP-1465251-B1 | Method for producing metal/ceramic bonded substrate | DOWA METALTECH CO LTD (JP) | 2019-01-23 | — | — | EP | claimed |
| US-7219826-B2 | Forming a desired fillet on the peripheral portion of a metal circuit; brazing | DOWA MINING CO., LTD. (JP) | 2007-05-22 | — | — | US | claimed |
| US-20040262367-A1 | Forming a desired fillet on the peripheral portion of a metal circuit; brazing | DOWA METALTECH CO., LTD. (JP) | 2004-12-30 | — | — | US | claimed |
| EP-1465251-A2 | Method for producing metal/ceramic bonded substrate | Dowa Mining Co., Ltd. (JP) | 2004-10-06 | — | — | EP | claimed |
| US-20240076541-A1 | RESIN COMPOSITION AND LIGHT-EMITTING DEVICE | NICHIA CORPORATION (JP) | 2024-03-07 | — | — | US | disclosed |
| WO-2023013718-A1 | LIQUID DETERGENT COMPOSITION FOR DISHWASHING MACHINES | 花王株式会社 | 2023-02-09 | — | — | WO | disclosed |
| EP-2916627-B1 | METHOD FOR MANUFACTURING CERAMIC CIRCUIT BOARD | HITACHI METALS LTD (JP) | 2019-04-03 | — | — | EP | disclosed |
| EP-1465251-B1 | Method for producing metal/ceramic bonded substrate | DOWA METALTECH CO LTD (JP) | 2019-01-23 | — | — | EP | disclosed |
| US-10104783-B2 | Method for producing ceramic circuit board | HITACHI METALS, LTD. (JP) | 2018-10-16 | — | — | US | disclosed |
| US-20160192503-A1 | METHOD FOR PRODUCING CERAMIC CIRCUIT BOARD | HITACHI METALS, LTD. (JP) | 2016-06-30 | — | — | US | disclosed |
| EP-2916627-A1 | METHOD FOR MANUFACTURING CERAMIC CIRCUIT BOARD | Hitachi Metals, Ltd. (JP) | 2015-09-09 | — | — | EP | disclosed |
| EP-1465251-A2 | Method for producing metal/ceramic bonded substrate | Dowa Mining Co., Ltd. (JP) | 2004-10-06 | — | — | EP | disclosed |