SCHEMBL5338716

SCHEMBL5338716

CCOC(C)C(CC)O[SiH3]

nearest known ligand 0.46

Predicted protein targets (top 2)

geneUniProtsupporting neighboursconfidence
LMNA P02545 1/20 0.46
THRB P10828 1/20 0.35

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL30587691 0.79 LMNA (0.50) LMNATHRB
SCHEMBL18493329 0.77 LMNA (0.48) LMNATHRB
SCHEMBL703116 0.73
SCHEMBL7730742 0.71 LMNA (0.60) LMNATHRB
SCHEMBL6423723 0.70
SCHEMBL2769493 0.70
SCHEMBL3481905 0.70 METAP1 (0.31)
SCHEMBL28115141 0.69 LMNA (0.50) LMNATHRB
SCHEMBL27471022 0.68 LMNA (0.56) LMNATHRB
SCHEMBL7260913 0.67

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 2 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-7238462-B2 Undercoating material for wiring, embedded material, and wiring formation method TOKYO OHKA KOGYO CO., LTD. (JP) 2007-07-03 US disclosed
US-20050074695-A1 Undercoating material for wiring, embedded material, and wiring formation method TOKYO OHKA KOGYO CO., LTD. (JP) 2005-04-07 US disclosed