SCHEMBL534972

SCHEMBL534972

CC[Si](CC)(OC)c1ccccc1

nearest known ligand 0.35

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
CA4 P22748 2/20 0.35
TP53 P04637 1/20 0.35
ESR1 P03372 1/20 0.32
ESR2 Q92731 1/20 0.32
TSHR P16473 2/20 0.32
LTA4H P09960 3/20 0.31
POLB P06746 1/20 0.31
CA12 O43570 1/20 0.31
CA1 P00915 1/20 0.31
CA2 P00918 1/20 0.31
CA7 P43166 1/20 0.31
CA9 Q16790 1/20 0.31
CA14 Q9ULX7 1/20 0.31
KDM4E B2RXH2 1/20 0.30
HSD17B10 Q99714 1/20 0.30
PSIP1 O75475 1/20 0.30
ELANE P08246 1/20 0.30
ALDH1A1 P00352 1/20 0.30
CYP1A2 P05177 1/20 0.30
CYP2C19 P33261 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL710831 0.87 ESR1 (0.37) ESR1ESR2
SCHEMBL3482435 0.87 TP53 (0.30) CA4TP53
SCHEMBL3481598 0.84 LTA4H (0.35) TSHRLTA4HCYP1A2CYP2C19
SCHEMBL9496164 0.83 TP53 (0.36) CA4TP53ESR1ESR2LTA4H
SCHEMBL14956282 0.82 MEN1 (0.31)
SCHEMBL703241 0.82 TP53 (0.32) CA4TP53ESR1ESR2TSHR
SCHEMBL28624856 0.80 MEN1 (0.43) ESR1ESR2TSHRHSD17B10ELANE
SCHEMBL14956602 0.80 IDH1 (0.30)
SCHEMBL533990 0.79 LTA4H (0.34) TP53ESR1ESR2TSHRLTA4H
SCHEMBL16398526 0.79 TP53 (0.33) TP53ESR1ESR2LTA4H

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 67 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-115181223-B Low-gloss matte auxiliary agent, preparation method thereof and molded body 铨盛聚碳科技股份有限公司 2023-08-29 CN claimed
EP-3812428-B1 COLLOIDAL STRUCTURE, MULTI-COLLOIDAL STRUCTURE, AND PRODUCTION METHOD FOR COLLOIDAL STRUCTURE PANASONIC IP MAN CO LTD (JP) 2025-12-03 EP disclosed
CN-116323713-B Curable composition and cured film 住友化学株式会社 2025-04-11 CN disclosed
WO-2024181199-A1 CURABLE COMPOSITION AND CURED FILM 住友化学株式会社 2024-09-06 WO disclosed
WO-2024176969-A1 METHOD FOR PRODUCING CARBONIC ACID DIESTER 国立研究開発法人産業技術総合研究所 2024-08-29 WO disclosed
CN-115181223-B Low-gloss matte auxiliary agent, preparation method thereof and molded body 铨盛聚碳科技股份有限公司 2023-08-29 CN disclosed
CN-112424290-B Colloid structure, colloid multiple structure, and method for producing colloid structure 松下知识产权经营株式会社 2023-08-22 CN disclosed
CN-116323713-A Curable composition and cured film 住友化学株式会社 2023-06-23 CN disclosed
CN-116323698-A Curable composition 住友化学株式会社 2023-06-23 CN disclosed
CN-116323685-A Curable composition 住友化学株式会社 2023-06-23 CN disclosed
US-20100007031-A1 AGENT FOR POST-ETCH TREATMENT OF SILICON DIELECTRIC FILM, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE FUJITSU LIMITED (JP) 2010-01-14 US disclosed
EP-2128897-A1 SILICON DIELECTRIC TREATING AGENT FOR USE AFTER ETCHING, PROCESS FOR PRODUCING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE Fujitsu Limited (JP) 2009-12-02 EP disclosed
US-7604866-B2 Comprising silica particles and at least one binder compound; good mechanical strength and abrasion resistance ASAHI KASEI KABUSHIKI KAISHA (JP) 2009-10-20 US disclosed
US-20070122631-A1 Flexible substrate and coating liquid SUMITOMO CORPORATION (JP) 2007-05-31 US disclosed
US-20070026689-A1 Silica film forming material, silica film and method of manufacturing the same, multilayer wiring structure and method of manufacturing the same, and semiconductor device and method of manufacturing the same FUJITSU LIMITED (JP) 2007-02-01 US disclosed
US-20060269724-A1 Comprising silica particles and at least one binder compound; good mechanical strength and abrasion resistance ASAHI KASEI KABUSHIKI KAISHA (JP) 2006-11-30 US disclosed
EP-1690839-A1 FLEXIBLE SUBSTRATE AND COATING LIQUID Sumitomo Corporation (JP) 2006-08-16 EP disclosed
CN-1809764-A Antireflective film ASAHI CHEMICAL IND (JP) 2006-07-26 CN disclosed
US-20050236985-A1 Flexible substrate and organic device using the same DAI NIPPON PRINTING CO., LTD. (JP) 2005-10-27 US disclosed
US-20040077757-A1 Coating composition for use in producing an insulating thin film ASAHI KASEI KABUSHIKI KAISHA (JP) 2004-04-22 US disclosed