SCHEMBL5355452

SCHEMBL5355452

CCCCO[SiH](Oc1ccccc1)Oc1ccccc1

nearest known ligand 0.53

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
LTA4H P09960 3/20 0.53
KCNA3 P22001 1/20 0.40
MLNR O43193 1/20 0.40
NR1I2 O75469 1/20 0.40
ESR1 P03372 1/20 0.40
NR3C1 P04150 1/20 0.40
PGR P06401 1/20 0.40
ADRB2 P07550 1/20 0.40
CHRM2 P08172 1/20 0.40
ADRB1 P08588 1/20 0.40
HTR1A P08908 1/20 0.40
ADRA2A P08913 1/20 0.40
ADORA3 P0DMS8 1/20 0.40
CHRM1 P11229 1/20 0.40
DRD2 P14416 1/20 0.40
ADRA2B P18089 1/20 0.40
ADRA2C P18825 1/20 0.40
CHRM3 P20309 1/20 0.40
MAOA P21397 1/20 0.40
CNR1 P21554 1/20 0.40

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL1608984 0.94 LTA4H (0.53) LTA4HKCNA3MLNRNR1I2ESR1
SCHEMBL1608013 0.88 LTA4H (0.42) LTA4HKCNA3MLNRNR1I2ESR1
SCHEMBL28693073 0.80 LTA4H (0.49) LTA4HKCNA3MLNRNR1I2ESR1
SCHEMBL28693072 0.80 LTA4H (0.49) LTA4HKCNA3MLNRNR1I2ESR1
SCHEMBL1609017 0.79 LTA4H (0.43) LTA4HKCNA3LMNATSHRTP53
SCHEMBL3354969 0.79 HDAC3 (0.58) LTA4HKCNA3DRD2DRD3ALDH1A1
Benz(B)Anthracene SCHEMBL5539519 0.77 LTA4H (0.44) LTA4HALDH1A1CYP3A4SMN1; SMN2CYP1A2
SCHEMBL9498549 0.77 ALDH1A1 (0.45) LTA4HKCNA3ESR1DRD2DRD3
SCHEMBL2114550 0.75 LTA4H (0.43) LTA4HKCNA3KCNH2LMNATSHR
SCHEMBL1331014 0.74 LTA4H (0.87) LTA4HKCNA3MLNRNR1I2ESR1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 5 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
WO-2022054912-A1 RESIN COMPOSITION, CURED PRODUCT AND MANUFACTURING METHOD THEREFOR, AND LAMINATE 三菱ケミカル株式会社 2022-03-17 WO disclosed
WO-2020235325-A1 SILICON-CONTAINING POLYMER, FILM-FORMING COMPOSITION, METHOD FOR SUPPORTING METAL COMPOUND ON SURFACE OF OBJECT TO BE TREATED, ARTICLE HAVING METAL COMPOUND-SUPPORTING COATING FILM, AND METHOD FOR PRODUCING SILICON-CONTAINING POLYMER 東京応化工業株式会社 (JP) 2020-11-26 WO disclosed
WO-2020230828-A1 SILICON-CONTAINING POLYMER, FILM-FORMING COMPOSITION, METHOD FOR FORMING SILICON-CONTAINING POLYMER COATING, METHOD FOR FORMING SILICA COATING, AND PRODUCTION METHOD FOR SILICON-CONTAINING POLYMER 東京応化工業株式会社 2020-11-19 WO disclosed
US-7238462-B2 Undercoating material for wiring, embedded material, and wiring formation method TOKYO OHKA KOGYO CO., LTD. (JP) 2007-07-03 US disclosed
US-20050074695-A1 Undercoating material for wiring, embedded material, and wiring formation method TOKYO OHKA KOGYO CO., LTD. (JP) 2005-04-07 US disclosed