Predicted protein targets (top 17)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | CYP2A6 | P11509 | 5/20 | 0.39 |
| ▸ | ALDH1A1 | P00352 | 4/20 | 0.39 |
| ▸ | HSD17B10 | Q99714 | 4/20 | 0.39 |
| ▸ | TSHR | P16473 | 3/20 | 0.39 |
| ▸ | TDP1 | Q9NUW8 | 1/20 | 0.39 |
| ▸ | HPRT1 | P00492 | 1/20 | 0.36 |
| ▸ | HIF1A | Q16665 | 1/20 | 0.33 |
| ▸ | CYP1B1 | Q16678 | 1/20 | 0.33 |
| ▸ | CYP1A2 | P05177 | 6/20 | 0.32 |
| ▸ | CYP2C19 | P33261 | 3/20 | 0.32 |
| ▸ | CYP2C9 | P11712 | 2/20 | 0.32 |
| ▸ | CYP3A4 | P08684 | 1/20 | 0.32 |
| ▸ | HPGD | P15428 | 1/20 | 0.32 |
| ▸ | KEAP1 | Q14145 | 1/20 | 0.32 |
| ▸ | CYP2D6 | P10635 | 1/20 | 0.31 |
| ▸ | PTPN22 | Q9Y2R2 | 1/20 | 0.30 |
| ▸ | PAX8 | Q06710 | 1/20 | 0.30 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL9400252 | 0.81 | ALDH1A1 (0.33) | CYP2A6ALDH1A1HSD17B10TSHRTDP1 | |
| SCHEMBL17848817 | 0.79 | HSD17B10 (0.39) | CYP2A6ALDH1A1HSD17B10TSHRTDP1 | |
| SCHEMBL455640 | 0.79 | CYP2A6 (0.39) | CYP2A6ALDH1A1HSD17B10TSHRTDP1 | |
| SCHEMBL9467597 | 0.79 | L3MBTL1 (0.42) | CYP2A6ALDH1A1HSD17B10TSHRTDP1 | |
| SCHEMBL1262323 | 0.79 | ALDH1A1 (0.39) | CYP2A6ALDH1A1HSD17B10TSHRTDP1 | |
| SCHEMBL2162377 | 0.79 | KDM4E (0.36) | CYP2A6ALDH1A1HSD17B10TSHRTDP1 | |
| SCHEMBL808527 | 0.76 | ALDH1A1 (0.40) | CYP2A6ALDH1A1HSD17B10TSHRTDP1 | |
| SCHEMBL1395580 | 0.76 | CALM1 (0.41) | CYP2A6ALDH1A1HSD17B10TSHRTDP1 | |
| SCHEMBL4629871 | 0.75 | ELANE (0.35) | CYP2A6ALDH1A1HSD17B10TSHRTDP1 | |
| SCHEMBL2500500 | 0.75 | MAPT (0.36) | CYP2A6ALDH1A1HSD17B10TSHRTDP1 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 44 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-3859447-B1 | PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, LAMINATE, METHOD FOR PRODUCING CURED FILM, AND SEMICONDUCTOR DEVICE | FUJIFILM CORP (JP) | 2025-11-19 | — | — | EP | disclosed |
| CN-112639616-B | Photosensitive resin composition, cured film, laminate, method for producing cured film, and semiconductor device | 富士胶片株式会社 | 2024-09-13 | — | — | CN | disclosed |
| EP-3405010-B1 | MULTILAYER TRANSMISSION LINE PLATE | RESONAC CORP (JP) | 2024-06-26 | — | — | EP | disclosed |
| CN-113717526-B | Resin composition, support with resin layer, prepreg, and laminate | 株式会社力森诺科 | 2024-06-11 | — | — | CN | disclosed |
| CN-112513219-B | Photosensitive resin composition, cured film, laminate, method for producing cured film, and semiconductor device | 富士胶片株式会社 | 2023-10-20 | — | — | CN | disclosed |
| CN-113337117-B | Resin composition, support, prepreg, laminate, multilayer printed wiring board, and printed wiring board for millimeter wave radar | 株式会社力森诺科 | 2023-07-14 | — | — | CN | disclosed |
| CN-112566997-B | Adhesive composition and method for manufacturing semiconductor device | 昭和电工材料株式会社 | 2023-03-24 | — | — | CN | disclosed |
| CN-113321888-B | Resin composition, resin film, prepreg, laminate, multilayer printed wiring board, and method for producing multilayer printed wiring board | 昭和电工材料株式会社 | 2022-12-23 | — | — | CN | disclosed |
| US-11377546-B2 | Resin composition, laminate sheet, and multilayer printed wiring board | SHOWA DENKO MATERIALS CO., LTD. (JP) | 2022-07-05 | — | — | US | disclosed |
| US-11339251-B2 | Resin composition, resin film, laminate, multilayer printed wiring board and method for producing multilayer printed wiring board | SHOWA DENKO MATERIALS CO., LTD. (JP) | 2022-05-24 | — | — | US | disclosed |
| EP-3489308-A1 | RESIN COMPOSITION, LAMINATE SHEET, AND MULTILAYER PRINTED WIRING BOARD | Hitachi Chemical Company, Ltd. (JP) | 2019-05-29 | — | — | EP | disclosed |
| EP-3489300-A1 | RESIN COMPOSITION, RESIN LAYER-PROVIDED SUPPORT, PREPREG, LAMINATE SHEET, MULTILAYER PRINTED WIRING BOARD, AND PRINTED WIRING BOARD FOR MILLIMETER-WAVE RADAR | Hitachi Chemical Company, Ltd. (JP) | 2019-05-29 | — | — | EP | disclosed |
| EP-3483214-A1 | RESIN COMPOSITION, RESIN FILM, LAMINATE, MULTILAYER PRINTED WIRING BOARD AND METHOD FOR PRODUCING MULTILAYER PRINTED WIRING BOARD | Hitachi Chemical Co., Ltd. (JP) | 2019-05-15 | — | — | EP | disclosed |
| US-20190023899-A1 | MULTILAYER TRANSMISSION LINE PLATE | RESONAC CORPORATION (JP) | 2019-01-24 | — | — | US | disclosed |
| EP-3405010-A1 | MULTILAYER TRANSMISSION LINE PLATE | Hitachi Chemical Company, Ltd. (JP) | 2018-11-21 | — | — | EP | disclosed |
| US-20180009195-A1 | RESIN FILM FOR FLEXIBLE PRINTED CIRCUIT BOARD, METAL FOIL PROVIDED WITH RESIN, COVERLAY FILM, BONDING SHEET, AND FLEXIBLE PRINTED CIRCUIT BOARD | RESONAC CORPORATION (JP) | 2018-01-11 | — | — | US | disclosed |
| US-20180002485-A1 | RESIN COMPOSITION, SUPPORT WITH RESIN LAYER, PREPREG, LAMINATE, MULTILAYERED PRINTED WIRING BOARD, AND PRINTED WIRING BOARD FOR MILLIMETER-WAVE RADAR | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2018-01-04 | — | — | US | disclosed |
| EP-3246352-A1 | RESIN COMPOSITION, SUPPORT WITH RESIN LAYER, PREPREG, LAMINATE, MULTILAYERED PRINTED WIRING BOARD, AND PRINTED WIRING BOARD FOR MILLIMETER-WAVE RADAR | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2017-11-22 | — | — | EP | disclosed |
| US-7173114-B2 | Lightfast colorant and lightfast ink composition including the same | SAMSUNG ELECTRONICS CO., LTD. (KR) | 2007-02-06 | — | — | US | disclosed |
| US-20040158050-A1 | Lightfast colorant and lightfast ink composition including the same | SAMSUNG ELECTRONICS CO., LTD. (KR) | 2004-08-12 | — | — | US | disclosed |