SCHEMBL5440264

SCHEMBL5440264

CCC(C(=O)O)n1cncn1

nearest known ligand 0.49

Predicted protein targets (top 14)

geneUniProtsupporting neighboursconfidence
MAPT P10636 1/20 0.49
PDE4D Q08499 1/20 0.41
PPARG P37231 1/20 0.40
CYP19A1 P11511 5/20 0.38
EGLN3 Q9H6Z9 1/20 0.38
LMNA P02545 1/20 0.38
CYP26A1 O43174 3/20 0.37
CYP1A2 P05177 1/20 0.36
CYP3A4 P08684 1/20 0.36
CYP2D6 P10635 1/20 0.36
CYP2C9 P11712 1/20 0.36
CYP2C19 P33261 1/20 0.36
HSP90AA1 P07900 1/20 0.36
KMT2A Q03164 1/20 0.36

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL2754295 0.84 MAPT (0.44) MAPTPDE4DPPARGCYP19A1EGLN3
SCHEMBL8562384 0.77 MAPT (0.43) MAPTPPARGCYP19A1EGLN3CYP26A1
SCHEMBL6107652 0.75 MAPT (0.40) MAPTCYP19A1EGLN3LMNACYP26A1
SCHEMBL12841481 0.75 MAPT (0.72) MAPTPPARGCYP19A1LMNACYP1A2
SCHEMBL7197056 0.75 MAPT (0.42) MAPTPDE4DCYP19A1EGLN3LMNA
SCHEMBL10799731 0.74 CYP19A1 (0.48) MAPTPDE4DCYP19A1LMNACYP3A4
SCHEMBL10798232 0.73 MAPT (0.45) MAPTPDE4DPPARGCYP19A1HSP90AA1
SCHEMBL10693353 0.72 MAPT (0.50) MAPTPPARGCYP19A1LMNACYP26A1
SCHEMBL12415427 0.71 MAPT (0.60) MAPTPDE4DCYP19A1LMNACYP26A1
SCHEMBL4640791 0.71 CYP19A1 (0.41) MAPTCYP19A1CYP26A1CYP3A4CYP2C9

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 6 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20250215572-A1 SURFACE TREATMENT AGENT FOR COPPER OR COPPER ALLOY SHIKOKU CHEMICALS CORPORATION (JP) 2025-07-03 US disclosed
EP-4506488-A1 SURFACE TREATMENT AGENT FOR COPPER OR COPPER ALLOY Shikoku Chemicals Corporation (JP) 2025-02-12 EP disclosed
WO-2023190263-A1 SURFACE TREATMENT AGENT FOR COPPER OR COPPER ALLOY 四国化成工業株式会社 2023-10-05 WO disclosed
US-20150184307-A1 SILVER ELECTROPLATING SOLUTION DAIWA FINE CHEMICALS CO., LTD. (LABORATORY) (JP) 2015-07-02 US disclosed
EP-2881497-A1 ELECTROSILVER PLATING FLUID Daiwa Fine Chemicals Co., Ltd. (JP) 2015-06-10 EP disclosed
US-20070284258-A1 Method For Silver Plating DAIWA FINE CHEMICALS CO., LTD. (JP) 2007-12-13 US disclosed