SCHEMBL545347

SCHEMBL545347

CC(C)(C)c1ccccc1C(=O)C(O)c1ccccc1

nearest known ligand 0.52

Predicted protein targets (top 15)

geneUniProtsupporting neighboursconfidence
LMNA P02545 3/20 0.52
CES2 O00748 3/20 0.52
CES1 P23141 3/20 0.52
MAPK1 P28482 1/20 0.47
ALDH1A1 P00352 4/20 0.45
KDM4E B2RXH2 1/20 0.45
HPGD P15428 1/20 0.43
SRC P12931 1/20 0.39
TDP1 Q9NUW8 3/20 0.38
TSHR P16473 2/20 0.38
HSD17B10 Q99714 1/20 0.38
MEN1 O00255 1/20 0.37
KMT2A Q03164 1/20 0.37
ATM Q13315 1/20 0.36
L3MBTL1 Q9Y468 1/20 0.36

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL31025728 0.88 LMNA (0.50) LMNACES2CES1MAPK1ALDH1A1
SCHEMBL9817968 0.87 LMNA (0.46) LMNACES2CES1MAPK1ALDH1A1
SCHEMBL680608 0.83 LMNA (0.52) LMNACES2CES1MAPK1ALDH1A1
SCHEMBL927384 0.82 ALDH1A1 (0.44) LMNAMAPK1ALDH1A1KDM4EHPGD
SCHEMBL12162720 0.78 ALDH1A1 (0.43) LMNAALDH1A1KDM4ETDP1TSHR
SCHEMBL7782501 0.77 LMNA (0.57) LMNACES2CES1MAPK1ALDH1A1
SCHEMBL387303 0.77 LMNA (0.57) LMNACES2CES1MAPK1ALDH1A1
SCHEMBL10428607 0.76 LMNA (0.61) LMNACES2CES1MAPK1ALDH1A1
SCHEMBL31058864 0.76 LMNA (0.47) LMNACES2CES1MAPK1ALDH1A1
SCHEMBL2814809 0.76 LMNA (0.47) LMNACES2CES1MAPK1ALDH1A1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 35 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-117924788-A Thermal expansion microsphere and preparation method thereof 万华化学集团股份有限公司 2024-04-26 CN claimed
CN-116120694-A Thermal expansion microsphere with core-shell structure and preparation method thereof 万华化学集团股份有限公司 2023-05-16 CN claimed
CN-117924788-A Thermal expansion microsphere and preparation method thereof 万华化学集团股份有限公司 2024-04-26 CN disclosed
CN-117813552-A Photosensitive composition for pattern formation and flexographic plate 日本瑞翁株式会社 2024-04-02 CN disclosed
CN-115190892-B High molecular weight acrylic triblock copolymer and adhesive composition containing the same 株式会社可乐丽 2024-01-30 CN disclosed
CN-117120539-A Resin composition comprising acrylic block copolymer 株式会社可乐丽 2023-11-24 CN disclosed
CN-112689561-B Method for producing laminated body 株式会社可乐丽 2023-08-29 CN disclosed
CN-110383171-B Photosensitive resin composition for flexographic printing plate, flexographic printing original plate, flexographic printing plate, and copolymer 旭化成株式会社 2023-07-28 CN disclosed
CN-112805331-B Pellets comprising a block copolymer and molded bodies obtained from the pellets 株式会社可乐丽 2023-06-09 CN disclosed
CN-106536047-B Catalyst and process for preparing same 埃科尼克科技有限公司 2020-10-30 CN disclosed
CN-106062261-B Crimped fiber and nonwoven fabric 出光兴产株式会社 2019-07-23 CN disclosed
EP-0464502-A1 Heat-sensitive recording material ASAHI DENKA KOGYO KABUSHIKI KAISHA (JP) 1992-01-08 EP disclosed
WO-1991013074-A2 TRANSITION METAL CATALYST COMPOSITION FOR OLEFIN POLYMERIZATION EXXON CHEMICAL PATENTS INC. (US) 1991-09-05 WO disclosed
US-4980336-A 1,2-bis(3,4-dimethylphenyl)ethane sensitizer ADEKA ARGUS CHEMICAL CO., LTD. (JP) 1990-12-25 US disclosed
EP-0367228-A2 Heat-sensitive recording material ASAHI DENKA KOGYO KABUSHIKI KAISHA (JP) 1990-05-09 EP disclosed
US-4783393-A UNSYMMETRICAL BIS/1,2-DIPHENYL-1,2-ETHANEDITHIOLATO/2-/-S,S*/-PLATINUM COMPOUNDS EASTMAN KODAK COMPANY (US) 1988-11-08 US disclosed
EP-0266164-A2 Dye mixtures and optical recording elements containing same EASTMAN KODAK COMPANY (a New Jersey corporation) (US) 1988-05-04 EP disclosed
EP-0017927-A2 Process for preparing photopolymerized elastomeric printing plates not displaying surface stickiness Asahi Kasei Kogyo Kabushiki Kaisha (JP) 1980-10-29 EP disclosed
US-4178327-A FIREPROOFING THE DOW CHEMICAL COMPANY (US) 1979-12-11 US disclosed
US-4054733-A MOLDING MATERIALS THE DOW CHEMICAL COMPANY (US) 1977-10-18 US disclosed