SCHEMBL547765

SCHEMBL547765

CC(C)(O)c1ccc(C(=O)c2ccc(C(C)(C)O)cc2)cc1

nearest known ligand 0.59

Predicted protein targets (top 19)

geneUniProtsupporting neighboursconfidence
SRD5A2 P31213 4/20 0.59
SIRT1 Q96EB6 1/20 0.52
ALDH1A1 P00352 3/20 0.50
LMNA P02545 2/20 0.50
ELANE P08246 4/20 0.47
MAPT P10636 2/20 0.46
PKM P14618 2/20 0.46
HPGD P15428 2/20 0.46
ESR1 P03372 1/20 0.46
ESR2 Q92731 1/20 0.46
HTT P42858 1/20 0.46
HDAC1 Q13547 1/20 0.45
NPC1 O15118 1/20 0.44
HSP90AA1 P07900 1/20 0.44
RAB9A P51151 1/20 0.44
SMN1; SMN2 Q16637 1/20 0.44
TDP1 Q9NUW8 1/20 0.43
CNR1 P21554 1/20 0.42
CNR2 P34972 1/20 0.42

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL547672 0.91 ALDH1A1 (0.58) SRD5A2ALDH1A1LMNAELANEMAPT
SCHEMBL548387 0.89 SRD5A2 (0.50) SRD5A2SIRT1ALDH1A1LMNAELANE
SCHEMBL28827166 0.89 SRD5A2 (0.55) SRD5A2SIRT1LMNAELANEMAPT
SCHEMBL547647 0.84 SRD5A2 (0.54) SRD5A2SIRT1TDP1
SCHEMBL107049 0.83 SRD5A2 (0.63) SRD5A2ALDH1A1SMN1; SMN2TDP1
SCHEMBL548546 0.83 EPHX2 (0.49) SRD5A2ALDH1A1LMNAMAPTHPGD
SCHEMBL1148445 0.82 SRD5A2 (0.83) SRD5A2SIRT1ALDH1A1LMNAMAPT
SCHEMBL10946728 0.82 SRD5A2 (0.83) SRD5A2SIRT1ALDH1A1LMNAMAPT
SCHEMBL6757198 0.82 SRD5A2 (0.61) SRD5A2SIRT1ALDH1A1LMNAELANE
SCHEMBL548036 0.82 SRD5A2 (0.43) SRD5A2SIRT1ALDH1A1LMNAELANE

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 131 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-114045148-B Photo-thermal dual-curing heat-conducting adhesive composition and preparation method thereof 广东睿华新材料科技有限公司 2023-09-15 CN claimed
CN-114045148-A Light-heat dual-curing adhesive and application thereof in blade lithium battery for vehicle 广州市麦冬科技有限公司 2022-02-15 CN claimed
CN-111286297-A High-strength ultraviolet/moisture dual-curing adhesive and preparation method and use method thereof 天津斯多福新材料研发有限公司 2020-06-16 CN claimed
US-4975471-A Photo-curable epoxy resin type composition KABUSHIKI KAISHA TOSHIBA (JP) 1990-12-04 US claimed
CN-117965125-A Flexible polyurethane acrylate adhesive for bonding ultrathin frameless liquid crystal display and preparation method thereof 滁州惠科光电科技有限公司 2024-05-03 CN disclosed
CN-114096590-B UV and/or thermally curable silicone-based materials and formulations 汉高股份有限及两合公司 2024-04-19 CN disclosed
US-11852970-B2 Material for lithography, production method therefor, composition for lithography, pattern formation method, compound, resin, and method for purifying the compound or the resin MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2023-12-26 US disclosed
CN-115572573-B Polyurethane hot melt adhesive for intelligent wearing and preparation method thereof 深圳市优威高乐技术有限公司 2023-12-19 CN disclosed
CN-114045148-B Photo-thermal dual-curing heat-conducting adhesive composition and preparation method thereof 广东睿华新材料科技有限公司 2023-09-15 CN disclosed
CN-113039245-B Dual curable silicone-organic hybrid polymer compositions for liquid optically clear adhesive applications 汉高股份有限及两合公司 2023-09-12 CN disclosed
CN-114874704-B Adhesive composition and display device 业成科技(成都)有限公司 2023-06-02 CN disclosed
CN-116063962-A Optically transparent water-resistant protective film composition based on double-network structure 常熟理工学院 2023-05-05 CN disclosed
EP-0409520-B1 Novel dialkyl peroxides, production method and use thereof NIPPON OILS & FATS CO LTD (JP) 1994-09-14 EP disclosed
US-5091586-A Photolysis type or pyrolysis type forming agents NIPPON OIL AND FATS COMPANY, LIMITED (JP) 1992-02-25 US disclosed
US-5055378-A Radiation curable acrylated Bisphenol A novolak epoxy resins; curing agents, fillers, photoinitiators; protective coating for printed circuit KABUSHIKI KAISHA TOSHIBA (JP) 1991-10-08 US disclosed
EP-0409520-A2 Novel dialkyl peroxides, production method and use thereof NIPPON OIL AND FATS COMPANY, LIMITED (JP) 1991-01-23 EP disclosed
US-4925773-A PHOTOCURABLE RESIN KABUSHIKI KAISHA TOSHIBA (JP) 1990-05-15 US disclosed
EP-0273729-A2 Solder resist ink composition KABUSHIKI KAISHA TOSHIBA (JP) 1988-07-06 EP disclosed
US-4691058-A Process for producing 1-hydroxy ketones CIBA-GEIGY CORPORATION (US) 1987-09-01 US disclosed
EP-0193643-A2 Curable resin composition KABUSHIKI KAISHA TOSHIBA (JP) 1986-09-10 EP disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (1 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-11852970-B2 Material for lithography, production method therefor, composition for lithography, pattern formation method, compound, resin, and method for purifying the compound or the resin SLC39A11, CROCC, TERB1 SRD5A2 2223/4885SIRT1 2685/4885ALDH1A1 3830/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.