SCHEMBL5484763

SCHEMBL5484763

COc1cc(C(c2cc(C3CCCCC3)c(O)cc2C)c2cc(C3CCCCC3)c(O)cc2C)cc(OC)c1OC

nearest known ligand 0.39

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 3/20 0.39
KDM4E B2RXH2 2/20 0.39
MAPT P10636 3/20 0.38
P4HB P07237 2/20 0.38
SMAD3 P84022 1/20 0.38
TUBB4A P04350 5/20 0.36
TUBB P07437 5/20 0.36
TUBA3C P0DPH7 5/20 0.36
TUBA1B P68363 5/20 0.36
TUBA4A P68366 5/20 0.36
TUBB4B P68371 5/20 0.36
TUBB3 Q13509 5/20 0.36
TUBB2A Q13885 5/20 0.36
TUBB8 Q3ZCM7 5/20 0.36
TUBA3E Q6PEY2 5/20 0.36
TUBA1A Q71U36 5/20 0.36
TUBA1C Q9BQE3 5/20 0.36
TUBB6 Q9BUF5 5/20 0.36
TUBB2B Q9BVA1 5/20 0.36
TUBB1 Q9H4B7 5/20 0.36

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL31048210 0.87 P4HB (0.39) ALDH1A1KDM4EMAPTP4HBTRPM8
SCHEMBL278541 0.87 P4HB (0.39) ALDH1A1KDM4EMAPTP4HBTRPM8
SCHEMBL2201745 0.87 TRPM8 (0.42) ALDH1A1MAPTTRPM8HPGDTSHR
SCHEMBL31048174 0.81 PTGDR2 (0.39) KDM4EMAPTP4HBSMAD3HTT
SCHEMBL5478536 0.81 PTGDR2 (0.39) KDM4EMAPTP4HBSMAD3HTT
SCHEMBL278769 0.81 NUDT1 (0.40) KDM4EMAPT
SCHEMBL29499852 0.78 NUDT1 (0.37)
SCHEMBL36658 0.78 NUDT1 (0.37)
SCHEMBL2864394 0.78 NUDT1 (0.37) ALDH1A1KDM4EPOLBHPGDTSHR
SCHEMBL29372915 0.78 NUDT1 (0.37)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 2 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20070299164-A1 Heatcurable dielectric resin composition and heatcurable dielectric resin film NIPPON PAINT CO., LTD. (JP) 2007-12-27 US disclosed
EP-1688965-A2 Heatcurable dielectric resin composition and heatcurable dielectric resin film Nippon Paint Co., Ltd. (JP) 2006-08-09 EP disclosed