SCHEMBL5487854

SCHEMBL5487854

C=Cc1ccc(CC[Si](Cl)(Cl)Cl)cc1

nearest known ligand 0.46

Predicted protein targets (top 14)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 2/20 0.46
TSHR P16473 1/20 0.36
POLB P06746 1/20 0.36
MAPT P10636 3/20 0.34
TP53 P04637 2/20 0.34
MEN1 O00255 1/20 0.34
KMT2A Q03164 1/20 0.34
TDP1 Q9NUW8 1/20 0.32
F2R P25116 1/20 0.31
HDAC8 Q9BY41 1/20 0.31
CA1 P00915 1/20 0.31
CA2 P00918 1/20 0.31
LMNA P02545 2/20 0.31
PSMD14 O00487 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL25674662 0.88 ALDH1A1 (0.42) ALDH1A1TSHRPOLBMAPTTP53
SCHEMBL3182709 0.84 ALDH1A1 (0.42) ALDH1A1TSHRPOLBMAPTTP53
SCHEMBL7975654 0.84 ALDH1A1 (0.42) ALDH1A1TSHRPOLBMAPTTP53
SCHEMBL6848455 0.82 CA2 (0.38) ALDH1A1TDP1CA2
SCHEMBL28409739 0.80 ALDH1A1 (0.42) ALDH1A1TSHRPOLBMAPTTP53
SCHEMBL1647493 0.79 ALDH1A1 (0.65) ALDH1A1TSHRPOLBMAPTTP53
SCHEMBL50012 0.79 ALDH1A1 (0.65) ALDH1A1TSHRPOLBMAPTTP53
SCHEMBL8760075 0.79 ALDH1A1 (0.46) ALDH1A1TSHRPOLBMAPTTP53
SCHEMBL9715824 0.78 ALDH1A1 (0.50) ALDH1A1TSHRPOLBMAPTTP53
SCHEMBL9715856 0.77 TP53 (0.41) ALDH1A1TSHRPOLBTP53MEN1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 8 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-112300495-A Silicon dioxide and propane-butadiene copolymer compound and preparation method thereof 中国石油天然气股份有限公司 2021-02-02 CN disclosed
US-20140187687-A1 INSULATION MATERIALS, INSULATION COMPOSITION COMPRISING THE SAME, AND SUBSTRATE USING THE SAME SAMSUNG ELECTRO-MECHANICS CO., LTD. (KR) 2014-07-03 US disclosed
US-20140187687-A1 INSULATION MATERIALS, INSULATION COMPOSITION COMPRISING THE SAME, AND SUBSTRATE USING THE SAME SAMSUNG ELECTRO-MECHANICS CO., LTD. (KR) 2014-07-03 US disclosed
US-7291747-B2 Silicon compounds and process for preparation thereof CHISSO CORPORATION (JP) 2007-11-06 US disclosed
US-20040143081-A1 Novel silicon compounds and process for preparation thereof JNC CORPORATION (JP) 2004-07-22 US disclosed
US-5098981-A POLYORGANOSILOXANE CHISSO CORPORATION (JP) 1992-03-24 US disclosed
EP-0349920-A2 Polyorganosiloxane Chisso Corporation (JP) 1990-01-10 EP disclosed
US-4202812-A CURED ELASTOMERS WITH IMPROVED TENSILE STRENGTH DOW CORNING CORPORATION (US) 1980-05-13 US disclosed