SCHEMBL5568873

SCHEMBL5568873

OCC(O)CC(OCC1CO1)C1CO1

nearest known ligand 0.31

Predicted protein targets (top 1)

geneUniProtsupporting neighboursconfidence
TSHR P16473 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL1727772 0.80 TSHR (0.33) TSHR
SCHEMBL9319612 0.80 LMNA (0.32)
SCHEMBL29288354 0.77 ALDH1A1 (0.34) TSHR
SCHEMBL2853094 0.73 ALDH1A1 (0.40) TSHR
Glycerin SCHEMBL23214508 0.71 TSHR (0.48) TSHR
SCHEMBL3645580 0.71 TSHR (0.38) TSHR
Glycerin SCHEMBL700209 0.71 TSHR (0.48) TSHR
Glycerin SCHEMBL3295078 0.71 TSHR (0.48) TSHR
Glycerin SCHEMBL42452 0.71 TSHR (0.48) TSHR
SCHEMBL27993875 0.71

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 2 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-9221969-B2 Thermally hardenable epoxy resin composition having an improved impact resistance at low temperatures SIKA TECHNOLOGY AG (CH) 2015-12-29 US disclosed
US-20070105983-A1 Thermally hardenable epoxy resin composition having an improved impact resistance at low temperatures SIKA TECHNOLOGY AG (CH) 2007-05-10 US disclosed