SCHEMBL5572095

SCHEMBL5572095

CCCCCCCCCC[SiH2]OC(CCC)CCC

nearest known ligand 0.37

Predicted protein targets (top 11)

geneUniProtsupporting neighboursconfidence
DNM1 Q05193 3/20 0.37
TSHR P16473 1/20 0.36
THRB P10828 1/20 0.36
LMNA P02545 1/20 0.33
SMPD1 P17405 3/20 0.31
OPRM1 P35372 1/20 0.31
ZDHHC7 Q9NXF8 1/20 0.31
MAPT P10636 1/20 0.31
MAPK1 P28482 1/20 0.31
GPR84 Q9NQS5 2/20 0.30
FDPS P14324 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL5574580 1.00 DNM1 (0.37) DNM1TSHRTHRBLMNASMPD1
SCHEMBL5574584 0.96 DNM1 (0.39) DNM1TSHRTHRBLMNA
SCHEMBL5574607 0.96 DNM1 (0.39) DNM1TSHRTHRBLMNA
SCHEMBL5574590 0.96 LMNA (0.35) DNM1TSHRTHRBLMNASMPD1
SCHEMBL5575126 0.96 LMNA (0.35) DNM1TSHRTHRBLMNASMPD1
SCHEMBL703889 0.96 LMNA (0.35) DNM1TSHRTHRBLMNASMPD1
SCHEMBL3241047 0.95
SCHEMBL3233161 0.95
SCHEMBL705853 0.93 OPRM1 (0.34) DNM1LMNASMPD1OPRM1FDPS
SCHEMBL713106 0.93

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-7169327-B2 Composite particle for dielectrics, ultramicroparticulate composite resin particle, composition for forming dielectrics and use thereof JSR CORPORATION (JP) 2007-01-30 US disclosed
EP-1566368-A2 Glass powder-containing resin composition, transfer film and process for manufacturing a plasma display panel comprising the transfer film JSR Corporation (JP) 2005-08-24 EP disclosed
EP-1387367-A1 COMPOSITE PARTICLE FOR DIELECTRICS, ULTRAMICROPARTICULATE COMPOSITE RESIN PARTICLE, COMPOSITION FOR FORMING DIELECTRICS AND USE THEREOF JSR Corporation (JP) 2004-02-04 EP disclosed
US-20030151032-A1 Composite particle for dielectrics, ultramicroparticulate composite resin particle, composition for forming dielectrics and use thereof JSR CORPORATION (JP) 2003-08-14 US disclosed