SCHEMBL5574584

SCHEMBL5574584

CCCCCCCCCC[SiH2]OC(CCC)CCCC

nearest known ligand 0.39

Predicted protein targets (top 6)

geneUniProtsupporting neighboursconfidence
DNM1 Q05193 3/20 0.39
TSHR P16473 1/20 0.33
THRB P10828 1/20 0.33
LMNA P02545 1/20 0.31
CTSK P43235 1/20 0.31
CA2 P00918 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL5574607 1.00 DNM1 (0.39) DNM1TSHRTHRBLMNACTSK
SCHEMBL704550 0.96 DNM1 (0.39) DNM1TSHRTHRBLMNACA2
SCHEMBL703889 0.96 LMNA (0.35) DNM1TSHRTHRBLMNA
SCHEMBL704163 0.96 DNM1 (0.39) DNM1TSHRTHRBLMNACA2
SCHEMBL5575126 0.96 LMNA (0.35) DNM1TSHRTHRBLMNA
SCHEMBL5574590 0.96 LMNA (0.35) DNM1TSHRTHRBLMNA
SCHEMBL703536 0.96 CTSK (0.33) DNM1CTSK
SCHEMBL5572095 0.96 DNM1 (0.37) DNM1TSHRTHRBLMNA
SCHEMBL5574580 0.96 DNM1 (0.37) DNM1TSHRTHRBLMNA
SCHEMBL705853 0.94 OPRM1 (0.34) DNM1LMNA

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-7169327-B2 Composite particle for dielectrics, ultramicroparticulate composite resin particle, composition for forming dielectrics and use thereof JSR CORPORATION (JP) 2007-01-30 US disclosed
EP-1566368-A2 Glass powder-containing resin composition, transfer film and process for manufacturing a plasma display panel comprising the transfer film JSR Corporation (JP) 2005-08-24 EP disclosed
EP-1387367-A1 COMPOSITE PARTICLE FOR DIELECTRICS, ULTRAMICROPARTICULATE COMPOSITE RESIN PARTICLE, COMPOSITION FOR FORMING DIELECTRICS AND USE THEREOF JSR Corporation (JP) 2004-02-04 EP disclosed
US-20030151032-A1 Composite particle for dielectrics, ultramicroparticulate composite resin particle, composition for forming dielectrics and use thereof JSR CORPORATION (JP) 2003-08-14 US disclosed