SCHEMBL5611787

SCHEMBL5611787

CCCCCCCC/C=C\CCCCCCCCNCCN1C=NCC1

nearest known ligand 0.37

Predicted protein targets (top 6)

geneUniProtsupporting neighboursconfidence
FAAH O00519 4/20 0.37
TRPV1 Q8NER1 2/20 0.37
PPARA Q07869 2/20 0.36
MGLL Q99685 2/20 0.35
ALDH1A1 P00352 1/20 0.35
TSHR P16473 1/20 0.35

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL5611795 1.00 FAAH (0.37) FAAHTRPV1PPARAMGLLALDH1A1
SCHEMBL11648940 0.92 ALDH1A1 (0.42) ALDH1A1TSHR
SCHEMBL28145460 0.92 ALDH1A1 (0.42) ALDH1A1TSHR
SCHEMBL28037627 0.91 FAAH (0.36) FAAHTRPV1PPARAMGLL
SCHEMBL28357384 0.90 FAAH (0.38) FAAHTRPV1PPARAALDH1A1TSHR
SCHEMBL11665961 0.90 ALDH1A1 (0.43) ALDH1A1TSHR
SCHEMBL16306 0.86 MGLL (0.44) FAAHTRPV1PPARAMGLLALDH1A1
SCHEMBL3785392 0.86 MGLL (0.44) FAAHTRPV1PPARAMGLLALDH1A1
SCHEMBL16308 0.86 MGLL (0.44) FAAHTRPV1PPARAMGLLALDH1A1
Hydrochloric Acid SCHEMBL1230862 0.84 MGLL (0.43) FAAHTRPV1MGLL

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 5 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-118880332-B Acidic etching solution for etching copper foil and preparation method thereof 深圳市京中康科技有限公司 2025-06-03 CN disclosed
CN-118880332-A Acidic etching solution for etching copper foil and preparation method thereof 深圳市京中康科技有限公司 2024-11-01 CN disclosed
CN-111394129-A Scale inhibitor for hydrogenation unit raw material and preparation method thereof 北京乐文科技发展有限公司 2020-07-10 CN disclosed
US-7226500-B2 Additive for heating asphalt KAO CORPORATION (JP) 2007-06-05 US disclosed
US-20050066855-A1 Additive for heating asphalt KAO CORPORATION (JP) 2005-03-31 US disclosed