Predicted protein targets (top 1)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | DPP4 | P27487 | 2/20 | 0.31 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL1055411 | 1.00 | DPP4 (0.31) | DPP4 | |
| SCHEMBL701989 | 0.89 | MEN1 (0.31) | — | |
| SCHEMBL3786070 | 0.88 | ALDH1A1 (0.31) | — | |
| SCHEMBL906381 | 0.85 | PKM (0.38) | DPP4 | |
| SCHEMBL565526 | 0.85 | PKM (0.38) | DPP4 | |
| SCHEMBL2940327 | 0.83 | ALDH1A1 (0.31) | — | |
| SCHEMBL701269 | 0.82 | — | — | |
| SCHEMBL1693621 | 0.79 | MEN1 (0.38) | — | |
| SCHEMBL2477009 | 0.79 | MEN1 (0.38) | — | |
| SCHEMBL6368717 | 0.78 | ALDH1A1 (0.35) | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 29 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-9465291-B2 | Radiation-sensitive resin composition, polymer, compound, and method for producing compound | JSR CORPORATION (JP) | 2016-10-11 | — | — | US | disclosed |
| US-9268219-B2 | Photoresist composition and resist pattern-forming method | JSR CORPORATION (JP) | 2016-02-23 | — | — | US | disclosed |
| US-9229320-B2 | Resist composition and method for producing resist pattern | SUMITOMO CHEMICAL COMPANY, LIMITED (JP) | 2016-01-05 | — | — | US | disclosed |
| US-20150301451-A1 | PATTERN FORMING METHOD, ACTINIC RAY-SENSITIVE OR RADIATION-SENSITIVE RESIN COMPOSITION, RESIST FILM, METHOD FOR MANUFACTURING ELECTRONIC DEVICE, AND ELECTRONIC DEVICE | FUJIFILM CORPORATION (JP) | 2015-10-22 | — | — | US | disclosed |
| US-8980529-B2 | Radiation-sensitive resin composition, polymer, and resist pattern-forming method | JSR CORPORATION (JP) | 2015-03-17 | — | — | US | disclosed |
| US-20140186771-A1 | RADIATION-SENSITIVE RESIN COMPOSITION, POLYMER, COMPOUND, AND METHOD FOR PRODUCING COMPOUND | JSR CORPORATION (JP) | 2014-07-03 | — | — | US | disclosed |
| US-8735044-B2 | Salt and photoresist composition containing the same | SUMITOMO CHEMICAL COMPANY, LIMITED (JP) | 2014-05-27 | — | — | US | disclosed |
| US-8614048-B2 | Resin, resist composition and method for producing resist pattern | SUMITOMO CHEMICAL COMPANY, LIMITED (JP) | 2013-12-24 | — | — | US | disclosed |
| US-8535872-B2 | Thermally cured underlayer for lithographic application | FUJIFILM ELECTRONIC MATERIALS, U.S.A., INC. (US) | 2013-09-17 | — | — | US | disclosed |
| US-20130203000-A1 | RADIATION-SENSITIVE RESIN COMPOSITION, POLYMER, AND RESIST PATTERN-FORMING METHOD | JSR CORPORATION (JP) | 2013-08-08 | — | — | US | disclosed |
| EP-1586594-B1 | ACRYLIC COPOLYMER AND RADIATION-SENSITIVE RESIN COMPOSITION | JSR CORP (JP) | 2010-09-15 | — | — | EP | disclosed |
| US-20100221664-A1 | RADIATION-SENSITIVE COMPOSITION | JSR CORPORATION (JP) | 2010-09-02 | — | — | US | disclosed |
| US-20100221659-A1 | COMPOUND, SALT, AND RADIATION-SENSITIVE RESIN COMPOSITION | JSR CORPORATION (JP) | 2010-09-02 | — | — | US | disclosed |
| US-20100167199-A1 | CHEMICALLY AMPLIFIED POSITIVE RESIST COMPOSITION | SUMITOMO CHEMICAL COMPANY, LIMITED (JP) | 2010-07-01 | — | — | US | disclosed |
| US-20100062373-A1 | POSITIVE RESIST COMPOSITION AND PATTERNING PROCESS | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2010-03-11 | — | — | US | disclosed |
| US-20080206676-A1 | THERMALLY CURED UNDERLAYER FOR LITHOGRAPHIC APPLICATION | FUJIFILM ELECTRONIC MATERIALS, U.S.A, INC | 2008-08-28 | — | — | US | disclosed |
| WO-2008103776-A2 | THERMALLY CURED UNDERLAYER FOR LITHOGRAPHIC APPLICATION | FUJIFILM ELECTRONIC MATERIALS U.S.A., INC. (US) | 2008-08-28 | — | — | WO | disclosed |
| EP-1586594-A1 | ACRYLIC COPOLYMER AND RADIATION-SENSITIVE RESIN COMPOSITION | JSR Corporation (JP) | 2005-10-19 | — | — | EP | disclosed |
| CN-1210623-C | Chemical amplifying type positive photoetching rubber composition | SUMITOMO CHEMICAL CO (JP) | 2005-07-13 | — | — | CN | disclosed |
| CN-1316675-A | Chemical amplifying type positive photoetching rubber composition | SUMITOMO CHEMICAL CO (JP) | 2001-10-10 | — | — | CN | disclosed |
Patent text — is the patent's own abstract consistent with the prediction?
For each of this compound's patents that has machine-readable text (2 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.
| Patent | Title | Text reads most about | Predicted target · text-rank |
|---|---|---|---|
| US-20100221659-A1 | COMPOUND, SALT, AND RADIATION-SENSITIVE RESIN COMPOSITION | AFF1, RER1, AFF4 | DPP4 4512/4885 |
| US-20100062373-A1 | POSITIVE RESIST COMPOSITION AND PATTERNING PROCESS | RER1, ASH2L, PHF2 | DPP4 4696/4885 |
“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.