SCHEMBL564772

SCHEMBL564772

CS(=O)(=O)O.[Ag]

nearest known ligand 0.00

Known targets — ChEMBL curated mechanism

ABL1ADRA1AADRA1BADRA1DADRA2AADRA2BADRA2CADRB2AGTR1BCL2BCL2A1BCL2L1BCL2L10BCL2L2BCRBRAFCHRM1CHRNA10CHRNA9DRD1DRD2DRD3DRD4DRD5EGFRF2FLT1FLT4GCKGHSRGNRHRGRIN1GRIN2AGRIN2BGRIN2CGRIN2DGRIN3AGRIN3BHTR1AHTR1BHTR1DHTR2AHTR2CHTR3AIDH2KDRKITMAOBMCL1MTTPPP4HBPDGFRBPIK3CAPIK3CBPIK3CDPIK3CGPIK3R1PIK3R2PIK3R3PIK3R5PIKFYVEROCK1ROCK2SLC18A2SLC6A2SLC6A3SLC6A4TACR1TUBA1ATUBA1BTUBA1CTUBA3CTUBA3ETUBA4ATUBBTUBB1TUBB2ATUBB2BTUBB3TUBB4ATUBB4BTUBB6TUBB8gyrAgyrBparCparEpol

The experimentally established mechanism targets of None. The predicted profile below is derived independently by chemical similarity — agreement is a validation signal, a miss is honest.

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL7057927 1.00 CA2 (0.54)
SCHEMBL28364296 1.00
SCHEMBL29222732 0.95
SCHEMBL20952510 0.95
SCHEMBL30427518 0.95
Fluoride SCHEMBL28112618 0.95
Fluoride SCHEMBL14562536 0.95
SCHEMBL25599 0.94 CA2 (0.58)
SCHEMBL8596055 0.94 CA2 (0.58)
SCHEMBL15109974 0.94

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 1754 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-12605477-B2 Compositions and methods for decontamination of surfaces Aviraban, LLC (US) 2026-04-21 US claimed
US-12418024-B2 Lithium metal battery with dendrite-suppressing coating and production method for same NANO AND ADVANCED MATERIALS INSTITUTE LIMITED (HK) 2025-09-16 US claimed
WO-2025136082-A1 CONDUCTIVE NANOPARTICLE FORMULATION MIMOS BERHAD (MY) 2025-06-26 WO claimed
US-12334562-B2 Lithium battery and method of preparing the same SAMSUNG ELECTRONICS CO., LTD. (KR) 2025-06-17 US claimed
CN-120026380-A Sn-Ag micro-bump electroplating solution based on sulfonic acid system and preparation method and application thereof 大连理工大学 2025-05-23 CN claimed
EP-4550482-A1 CATALYST ELECTRODE, METHOD FOR MANUFACTURING CATALYST ELECTRODE AND MEMBRANE ELECTRODE ASSEMBLY SK Innovation Co., Ltd. (KR) 2025-05-07 EP claimed
EP-4549633-A1 CYANIDE-FREE SILVER BATH COMPOSITION AND USES THEREOF AXON CABLE (FR) 2025-05-07 EP claimed
CN-115389575-B Platinum-porous silver composite electrode, preparation method thereof and application thereof in neurotransmitter molecule detection 广州钰芯智能科技研究院有限公司 2025-05-06 CN claimed
CN-119852032-A Silver wire processing method and silver wire based on laser direct writing system 中国工程物理研究院材料研究所 2025-04-18 CN claimed
US-20250125380-A1 Catalyst Electrode, Method for Manufacturing Catalyst Electrode and Membrane Electrode Assembly SK INNOVATION CO., LTD. (KR) 2025-04-17 US claimed
EP-1680394-A1 NOVEL NITROPHENYL MUSTARD AND NITROPHENYLAZIRIDINE ALCOHOLS AND THEIR CORRESPONDING PHOSPHATES AND THEIR USE AS TARGETED CYTOTOXIC AGENTS Auckland Uniservices Limited (NZ) 2006-07-19 EP claimed
WO-2005042471-A1 NOVEL NITROPHENYL MUSTARD AND NITROPHENYLAZIRIDINE ALCOHOLS AND THEIR CORRESPONDING PHOSPHATES AND THEIR USE AS TARGETED CYTOTOXIC AGENTS AUCKLAND UNISERVICES LIMITED (NZ) 2005-05-12 WO claimed
EP-0893514-B1 Tin-silver alloy plating solution and method of plating with said plating solution NAGANO PREFECTURE (JP) 2003-04-02 EP claimed
US-6395583-B1 NICKEL, COPPER, IRON, OR ALLOY THEREOF MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. (JP) 2002-05-28 US claimed
US-6251249-B1 IODIDE-FREE AND CONTAIN AN ORGANOSULFUR COMPOUND AND/OR A CARBOXYLIC ACID; PRECIOUS METAL ALKANESULFONATES, PRECIOUS METAL ALKANESULFONAMIDES AND/OR PRECIOUS METAL SOURCE ATOFINA CHEMICALS, INC. 2001-06-26 US claimed
US-5902472-A FOR ELECTRODEPOSITION OF A TIN-SILVER ALLOY WITH A HIGH CURRENT EFFICIENCY AND WITHOUT USING A CYANIDE MATERIAL, SAID PLATING SOLUTION COMPRISING A TIN COMPOUND, A SILVER COMPOUND, A PYROPHOSPHORIC ACID AND AN IODIC COMPOUND NAGANOKEN AND SHINKO ELECTRIC INDUSTRIES CO., LTD. (JP) 1999-05-11 US claimed
EP-0893514-A2 Aqueous solution for forming metallic complex, tin-silver alloy plating solution, and method of plating with said plating solution Naganoken (JP) 1999-01-27 EP claimed
EP-0818563-A1 AQUEOUS SOLUTION FOR FORMING METAL COMPLEXES, TIN-SILVER ALLOY PLATING BATH, AND PROCESS FOR PRODUCING PLATED OBJECT USING THE PLATING BATH Naganoken (JP) 1998-01-14 EP claimed
US-4673472-A Method and electroplating solution for deposition of palladium or alloys thereof TECHNIC INC. (US) 1987-06-16 US claimed
US-3997533-A Process for the preparation of 7-acylamino-desacetoxycephalosporanic derivatives BAYER AKTIENGESELLSCHAFT (DT) 1976-12-14 US claimed