SCHEMBL565675

SCHEMBL565675

C[N+](C)(Cc1ccc(Cl)cc1)c1ccccc1.O=S(=O)([O-])C(F)(F)C(F)(F)C(F)(F)C(F)(F)F

nearest known ligand 0.33

Predicted protein targets (top 12)

geneUniProtsupporting neighboursconfidence
CA1 P00915 11/20 0.33
CA2 P00918 11/20 0.33
MMP1 P03956 3/20 0.33
MMP2 P08253 3/20 0.33
MMP9 P14780 3/20 0.33
MMP8 P22894 3/20 0.33
MMP13 P45452 3/20 0.33
EGFR P00533 1/20 0.32
ERBB2 P04626 1/20 0.32
CNR1 P21554 1/20 0.31
CNR2 P34972 1/20 0.31
KMT2A Q03164 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL565099 0.85 HTT (0.37) CA1CA2EGFRERBB2KMT2A
SCHEMBL11758384 0.78 KDM4E (0.47) CA1CA2MMP1MMP2MMP9
Trifluoromethanesulfonic Acid SCHEMBL565680 0.78 GPR3 (0.40)
SCHEMBL565256 0.77 KDM4E (0.43) EGFRERBB2
Trifluoromethanesulfonic Acid SCHEMBL565684 0.76 GPR3 (0.41) CNR2
SCHEMBL218929 0.74 CA2 (0.38) CA1CA2MMP1MMP2MMP9
Fluoride Ion SCHEMBL124361 0.74 TDP1 (0.41) EGFRERBB2
Fluoride Ion SCHEMBL124362 0.74 TDP1 (0.41) EGFRERBB2
SCHEMBL9792102 0.74 CA1 (0.38) CA1CA2MMP1MMP2MMP9
SCHEMBL3144495 0.73 CA1 (0.33) CA1CA2MMP1MMP2MMP9

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 8 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-8729166-B2 Polymer composition for microelectronic assembly PROMERUS, LLC (US) 2014-05-20 US disclosed
US-20140024750-A1 Polymer Composition for Microelectronic Assembly PROMERUS, LLC (US) 2014-01-23 US disclosed
US-8575248-B2 Polymer composition for microelectronic assembly PROMERUS, LLC (US) 2013-11-05 US disclosed
EP-2601239-A1 POLYMER COMPOSITION FOR MICROELECTRONIC ASSEMBLY Promerus, LLC (US) 2013-06-12 EP disclosed
US-20120034387-A1 Polymer Composition for Microelectronic Assembly PROMERUS LLC (US) 2012-02-09 US disclosed
WO-2012019092-A1 POLYMER COMPOSITION FOR MICROELECTRONIC ASSEMBLY PROMERUS LLC (US) 2012-02-09 WO disclosed
WO-2005097883-A2 METHOD OF PRODUCING A CROSSLINKED COATING IN THE MANUFACTURE OF INTEGRATED CIRCUITS KING INDUSTRIES, INC. (US) 2005-10-20 WO disclosed
US-20050215713-A1 Method of producing a crosslinked coating in the manufacture of integrated circuits KING INDUSTRIES, INC. 2005-09-29 US disclosed