SCHEMBL5669482

SCHEMBL5669482

C#Cc1ccccc1Oc1cc(C(=O)O)ccc1C(=O)O.c1cc2cc-2c1

nearest known ligand 0.44

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
KMO O15229 1/20 0.44
KDM4E B2RXH2 1/20 0.38
EZH2 Q15910 1/20 0.38
ACMSD Q8TDX5 2/20 0.38
LMNA P02545 1/20 0.38
RAB9A P51151 1/20 0.38
HTT P42858 1/20 0.38
TTR P02766 2/20 0.37
GALK1 P51570 1/20 0.37
CASP6 P55212 1/20 0.37
MCL1 Q07820 1/20 0.37
PLEC Q15149 1/20 0.37
TDP1 Q9NUW8 1/20 0.37
IDO1 P14902 2/20 0.37
PTPN11 Q06124 1/20 0.36
AKR1C3 P42330 1/20 0.36
HNF4A P41235 1/20 0.36
DHODH Q02127 1/20 0.36
DCLRE1A Q6PJP8 1/20 0.36
DCLRE1B Q9H816 1/20 0.36

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL2745853 0.94 KDM4E (0.43) KDM4EEZH2LMNARAB9AHTT
SCHEMBL5667719 0.82 KMO (0.41) KMOKDM4EACMSDLMNARAB9A
SCHEMBL2746171 0.81 DHODH (0.44) KMOEZH2TTRAKR1C3DHODH
SCHEMBL5667821 0.80 RXRA (0.41) KDM4ELMNARAB9AHTTTTR
SCHEMBL4440190 0.80 KMO (0.51) KMOKDM4EACMSDHNF4ADHODH
SCHEMBL5667928 0.78 KMO (0.47) KMOKDM4EACMSDTTRHNF4A
SCHEMBL2747620 0.78 RAB9A (0.43) KDM4ELMNARAB9AHTTTTR
SCHEMBL29038528 0.78 HTT (0.59) KDM4ELMNARAB9AHTTTTR
SCHEMBL1927621 0.75 ACMSD (0.50) KMOACMSDMCL1PTPN11HNF4A
SCHEMBL2747651 0.74 HTT (0.44) KDM4ELMNAHTTTDP1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 7 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-1333050-B1 MATERIAL FOR INSULATING FILM, COATING VARNISH FOR INSULATING FILM, AND INSULATING FILM AND SEMICONDUCTOR DEVICE USING THE SAME SUMITOMO BAKELITE CO (JP) 2006-12-27 EP disclosed
US-7049371-B2 Material for an insulating film, coating varnish for an insulating film, and insulating film and semiconductor device using the same SUMITOMO BAKELITE COMPANY, LTD. (JP) 2006-05-23 US disclosed
US-20040002572-A1 Material for an insulating film, coating varnish for an insulating film, and insulating film and semiconductor device using the same SUMITOMO BAKELITE COMPANY, LTD. (JP) 2004-01-01 US disclosed
EP-1333050-A1 MATERIAL FOR INSULATING FILM, COATING VARNISH FOR INSULATING FILM, AND INSULATING FILM AND SEMICONDUCTOR DEVICE USING THE SAME SUMITOMO BAKELITE CO., LTD. (JP) 2003-08-06 EP disclosed
EP-1327653-A1 HEAT-RESISTANT RESIN PRECURSOR, HEAT-RESISTANT RESIN AND INSULATING FILM AND SEMICONDUCTOR DEVICE SUMITOMO BAKELITE CO., LTD. (JP) 2003-07-16 EP disclosed
US-6518390-B2 Polybenzoxazole and crosslinking agent SUMITOMO BAKELITE COMPANY, LTD. (JP) 2003-02-11 US disclosed
US-20020013443-A1 Precursor of a heat resistant resin, heat resistant resin, insulating film and semiconductor device SUMITOMO BAKELITE CO., LTD. (JP) 2002-01-31 US disclosed