SCHEMBL5685341

SCHEMBL5685341

CCCCCCCCCC(C(=O)O)C(=O)N(NC(=O)c1ccccc1O)C(=O)c1ccccc1O

nearest known ligand 0.50

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
NAAA Q02083 2/20 0.50
ALDH1A1 P00352 4/20 0.41
LMNA P02545 4/20 0.41
KDM4E B2RXH2 4/20 0.41
HPGD P15428 4/20 0.41
HSD17B10 Q99714 4/20 0.41
TSHR P16473 3/20 0.41
AGTR1 P30556 1/20 0.39
AGTR2 P50052 1/20 0.39
HDAC7 Q8WUI4 1/20 0.38
GAA P10253 2/20 0.38
SMN1; SMN2 Q16637 1/20 0.38
NPC1 O15118 2/20 0.37
KMT2A Q03164 2/20 0.37
POLB P06746 1/20 0.37
RAB9A P51151 1/20 0.37
MCOLN3 Q8TDD5 1/20 0.37
CTDSP1 Q9GZU7 1/20 0.37
PRSS1 P07477 1/20 0.37
PRSS2 P07478 1/20 0.37

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL2230284 0.81 NAAA (0.48) NAAALMNAHSD17B10POLBPRSS1
SCHEMBL2231656 0.81 NAAA (0.48) NAAALMNAHSD17B10POLBPRSS1
SCHEMBL2231486 0.80 NAAA (0.46) NAAALMNAHSD17B10POLBPRSS1
SCHEMBL5391442 0.79 NAAA (0.58) NAAAALDH1A1LMNAKDM4EHPGD
SCHEMBL11768734 0.74 NAAA (0.58) NAAAALDH1A1LMNAKDM4EHPGD
SCHEMBL4608702 0.74 NAAA (0.58) NAAAALDH1A1LMNAKDM4EHPGD
SCHEMBL4586238 0.74 NAAA (0.58) NAAAALDH1A1LMNAKDM4EHPGD
SCHEMBL6384132 0.73 NAAA (0.56) NAAAALDH1A1LMNAKDM4EHPGD
SCHEMBL28301911 0.73 NAAA (0.59) NAAAALDH1A1LMNAKDM4EHPGD
SCHEMBL9067407 0.72 CA1 (0.50) NAAAALDH1A1LMNAKDM4EHPGD

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 28 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-1253169-B1 Degradation inhibitor for resin material, chlorine water-resistant resin composition and method for inhibiting degradation API CORP (JP) 2006-03-15 EP claimed
CN-119730985-B Soldering flux and method for producing bonded body 千住金属工业株式会社 2026-02-27 CN disclosed
US-12269806-B2 Flux and solder paste SENJU METAL INDUSTRY CO., LTD. (JP) 2025-04-08 US disclosed
CN-119730985-A Soldering flux and method for producing bonded body 千住金属工业株式会社 2025-03-28 CN disclosed
CN-119730984-A Soldering flux and preparation method of electronic component 千住金属工业株式会社 2025-03-28 CN disclosed
CN-118176084-B Soldering flux and method for producing bonded body 千住金属工业株式会社 2025-03-18 CN disclosed
CN-118354863-B Method for producing soldering flux and bonded body 千住金属工业株式会社 2025-02-25 CN disclosed
WO-2025033185-A1 FLUX AND METHOD FOR PRODUCING JOINED BODY 千住金属工業株式会社 2025-02-13 WO disclosed
CN-118201735-B Soldering flux and method for producing bonded body 千住金属工业株式会社 2025-01-10 CN disclosed
US-20240408705-A1 WATER-SOLUBLE FLUX AND SOLDER PASTE SENJU METAL INDUSTRY CO., LTD. (JP) 2024-12-12 US disclosed
CN-118176084-A Soldering flux and method for producing bonded body 千住金属工业株式会社 2024-06-11 CN disclosed
CN-118055828-A Soldering flux and soldering paste 千住金属工业株式会社 2024-05-17 CN disclosed
CN-117620522-A Method for producing soldering flux and bonded body 千住金属工业株式会社 2024-03-01 CN disclosed
WO-2024043231-A1 FLUX AND METHOD FOR PRODUCING ELECTRONIC COMPONENT 千住金属工業株式会社 2024-02-29 WO disclosed
WO-2024043223-A1 FLUX AND METHOD FOR PRODUCING BONDED OBJECT 千住金属工業株式会社 2024-02-29 WO disclosed
CN-117500632-A Soldering flux and soldering paste 千住金属工业株式会社 2024-02-02 CN disclosed
CN-117377552-A Soldering flux and soldering paste 千住金属工业株式会社 2024-01-09 CN disclosed
WO-2023171471-A1 FLUX AND SOLDER PASTE 千住金属工業株式会社 2023-09-14 WO disclosed
EP-1253169-B1 Degradation inhibitor for resin material, chlorine water-resistant resin composition and method for inhibiting degradation API CORP (JP) 2006-03-15 EP disclosed
EP-1253169-A2 Degradation inhibitor for resin material, chlorine water-resistant resin composition and method for inhibiting degradation Yoshitomi Fine Chemicals, Ltd. (JP) 2002-10-30 EP disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (1 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-12269806-B2 Flux and solder paste OTC, SLC25A11, PROC NAAA 951/4885ALDH1A1 3001/4885LMNA 1684/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.