⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| Ethylamine SCHEMBL28351218 | 1.00 | DNM1 (0.31) | — | |
| Ethylamine SCHEMBL5742265 | 1.00 | — | — | |
| Ethylamine SCHEMBL15646032 | 1.00 | — | — | |
| Ethylamine SCHEMBL979530 | 0.94 | — | — | |
| Ethylamine SCHEMBL342520 | 0.94 | DNM1 (0.33) | — | |
| Ethylamine SCHEMBL28448202 | 0.94 | — | — | |
| Ethylamine SCHEMBL635354 | 0.94 | — | — | |
| Ethylamine SCHEMBL4297060 | 0.94 | — | — | |
| Ethylamine SCHEMBL4518356 | 0.94 | DNM1 (0.33) | — | |
| Ethylamine SCHEMBL342521 | 0.94 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 29 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| JP-55165098-A | — | — | None | — | — | JP | disclosed |
| CN-117280087-A | Carbon fiber bundle and method for producing same | 东丽株式会社 | 2023-12-22 | — | — | CN | disclosed |
| CN-112368432-B | Carbon fiber and method for producing same | 东丽株式会社 | 2023-07-28 | — | — | CN | disclosed |
| CN-111788341-B | Carbon fiber bundle and method for producing same | 东丽株式会社 | 2023-05-05 | — | — | CN | disclosed |
| CN-110167994-B | Silver-coated silicone rubber particles, conductive paste containing the particles, and method for producing conductive film using the conductive paste | 三菱综合材料株式会社 | 2022-07-29 | — | — | CN | disclosed |
| CN-111601919-B | Fire-resistant fiber bundle and method for producing carbon fiber bundle | 东丽株式会社 | 2022-06-28 | — | — | CN | disclosed |
| CN-110637047-B | Block copolymer and method for producing same, epoxy resin composition, cured product thereof, and semiconductor sealing material | 东丽株式会社 | 2021-11-12 | — | — | CN | disclosed |
| EP-3125254-B1 | CONDUCTIVE PASTE | MITSUBISHI MATERIALS CORP (JP) | 2020-12-23 | — | — | EP | disclosed |
| CN-108137930-B | Resin composition, bonded body, and semiconductor device | 三菱综合材料株式会社 | 2020-11-20 | — | — | CN | disclosed |
| CN-111601919-A | Method for producing fire-resistant fiber bundle and method for producing carbon fiber bundle | 东丽株式会社 | 2020-08-28 | — | — | CN | disclosed |
| EP-2918371-A1 | Solderable conductive polymer thick film composition | Heraeus Precious Metals North America Conshohocken LLC (US) | 2015-09-16 | — | — | EP | disclosed |
| US-20150257279-A1 | SOLDERABLE CONDUCTIVE POLYMER THICK FILM COMPOSITION | HERAEUS PRECIOUS METALS NORTH AMERICA CONSHOHOCKEN LLC | 2015-09-10 | — | — | US | disclosed |
| CN-102165016-B | Curable composition and cured product thereof | KANEKA CORP | 2014-03-12 | — | — | CN | disclosed |
| CN-102165016-A | Curable composition and cured product thereof | KANEKA CORP | 2011-08-24 | — | — | CN | disclosed |
| EP-0879854-B1 | A resin composition for a fibre reinforced composite, a prepreg and a fibre reinforced composite | TORAY INDUSTRIES (JP) | 2006-06-21 | — | — | EP | disclosed |
| US-6287696-B1 | BLEND OF THERMOPLASTIC AND THERMOSETTING RESINS | TORAY INDUSTRIES, INC. (JP) | 2001-09-11 | — | — | US | disclosed |
| EP-0982365-A1 | EPOXY RESIN COMPOSITION | Daiso Co., Ltd. (JP) | 2000-03-01 | — | — | EP | disclosed |
| EP-0879854-A2 | A resin composition for a fibre reinforced composite, a prepreg and a fibre reinforced composite | TORAY INDUSTRIES, INC. (JP) | 1998-11-25 | — | — | EP | disclosed |
| US-5610209-A | NAPHTHALENEDICARBOXYLIC DIHYDRAZIDE | JAPAN HYDRAZINE CO., LTD. (JP) | 1997-03-11 | — | — | US | disclosed |
| JP-S55165098-A | ACOUSTIC DIAPHRAGM PLATE | MATSUSHITA ELECTRIC IND CO LTD | 1980-12-23 | — | — | JP | disclosed |