Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | CA1 | P00915 | 2/20 | 0.38 |
| ▸ | CA2 | P00918 | 2/20 | 0.38 |
| ▸ | TP53 | P04637 | 1/20 | 0.35 |
| ▸ | TSHR | P16473 | 1/20 | 0.35 |
| ▸ | GSK3B | P49841 | 2/20 | 0.34 |
| ▸ | MMP2 | P08253 | 1/20 | 0.33 |
| ▸ | MMP12 | P39900 | 1/20 | 0.33 |
| ▸ | RARB | P10826 | 1/20 | 0.32 |
| ▸ | RARG | P13631 | 1/20 | 0.32 |
| ▸ | PARP15 | Q460N3 | 1/20 | 0.31 |
| ▸ | PARP10 | Q53GL7 | 1/20 | 0.31 |
| ▸ | PARP2 | Q9UGN5 | 1/20 | 0.31 |
| ▸ | ESR1 | P03372 | 1/20 | 0.31 |
| ▸ | ESR2 | Q92731 | 1/20 | 0.31 |
| ▸ | SRD5A2 | P31213 | 1/20 | 0.31 |
| ▸ | LMNA | P02545 | 1/20 | 0.31 |
| ▸ | MAPT | P10636 | 1/20 | 0.31 |
| ▸ | PKM | P14618 | 1/20 | 0.31 |
| ▸ | HPGD | P15428 | 1/20 | 0.31 |
| ▸ | HTT | P42858 | 1/20 | 0.31 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL2641715 | 0.87 | KMT2A (0.47) | CA1CA2TP53TSHRGSK3B | |
| SCHEMBL27352439 | 0.83 | CES1 (0.44) | CA1CA2TSHRGSK3BSRD5A2 | |
| Bicarbonate SCHEMBL11402475 | 0.83 | TSHR (0.35) | CA1CA2TP53TSHRMMP2 | |
| SCHEMBL11238566 | 0.81 | SRD5A2 (0.50) | CA1CA2ESR1ESR2SRD5A2 | |
| SCHEMBL536808 | 0.79 | TSHR (0.63) | CA1CA2TP53TSHRRARB | |
| SCHEMBL14877306 | 0.78 | CES2 (0.41) | TP53TSHRRARBMAPTPKM | |
| SCHEMBL103281 | 0.77 | CA1 (0.37) | CA1CA2TP53TSHRGSK3B | |
| SCHEMBL8401560 | 0.77 | CA1 (0.37) | CA1CA2TP53TSHRGSK3B | |
| SCHEMBL2163556 | 0.77 | CA2 (0.64) | CA1CA2GSK3BPARP15PARP10 | |
| SCHEMBL4757633 | 0.77 | PARP10 (0.52) | CA1CA2TSHRPARP15PARP10 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 16 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| WO-2006122414-A1 | DEPOT FOR SUSTAINED AND CONTROLLED DELIVERY OF METHOTREXATE | MATREGEN CORP. (CA) | 2006-11-23 | — | — | WO | claimed |
| US-20220033557-A1 | PHOTOPOLYMERIZATION METHOD FOR PREPARING BLOCK COPOLYMER WITH MAIN-CHAIN SEMI-FLUORINATED ALTERNATING COPOLYMER | SOOCHOW UNIVERSITY (CN) | 2022-02-03 | — | — | US | disclosed |
| US-10059798-B2 | Active ester resin, epoxy resin composition, cured product thereof, prepreg, circuit board, and build-up film | DIC CORPORATION (JP) | 2018-08-28 | — | — | US | disclosed |
| US-9963544-B2 | Active ester resin containing phosphorus atom, epoxy resin composition and cured product thereof, prepreg, circuit board, and build-up film | DIC CORPORATION (JP) | 2018-05-08 | — | — | US | disclosed |
| EP-2589625-B1 | THERMOSETTING RESIN COMPOSITION, CURED PRODUCT THEREOF, ACTIVE ESTER RESIN, SEMICONDUCTOR SEALING MATERIAL, PREPREG, PRINTED CIRCUIT BOARD, AND BUILD-UP FILM | DAINIPPON INK & CHEMICALS (JP) | 2016-10-26 | — | — | EP | disclosed |
| US-20160130391-A1 | ACTIVE ESTER RESIN CONTAINING PHOSPHORUS ATOM, EPOXY RESIN COMPOSITION AND CURED PRODUCT THEREOF, PREPREG, CIRCUIT BOARD, AND BUILD-UP FILM | DIC CORPORATION (JP) | 2016-05-12 | — | — | US | disclosed |
| US-20150344617-A1 | ACTIVE ESTER RESIN, EPOXY RESIN COMPOSITION, CURED PRODUCT THEREOF, PREPREG, CIRCUIT BOARD, AND BUILD-UP FILM | DIC CORPORATION (JP) | 2015-12-03 | — | — | US | disclosed |
| US-8669333-B2 | Thermosetting resin composition, cured product thereof, active ester resin, semiconductor encapsulating material, prepreg, circuit board, and build-up film | DIC CORPORATION (JP) | 2014-03-11 | — | — | US | disclosed |
| EP-2589625-A1 | THERMOSETTING RESIN COMPOSITION, CURED PRODUCT THEREOF, ACTIVE ESTER RESIN, SEMICONDUCTOR SEALING MATERIAL, PREPREG, PRINTED CIRCUIT BOARD, AND BUILD-UP FILM | DIC Corporation (JP) | 2013-05-08 | — | — | EP | disclosed |
| US-20130101857-A1 | THERMOSETTING RESIN COMPOSITION, CURED PRODUCT THEREOF, ACTIVE ESTER RESIN, SEMICONDUCTOR ENCAPSULATING MATERIAL, PREPREG, CIRCUIT BOARD, AND BUILD-UP FILM | DIC CORPORATION (JP) | 2013-04-25 | — | — | US | disclosed |
| WO-2006122414-A1 | DEPOT FOR SUSTAINED AND CONTROLLED DELIVERY OF METHOTREXATE | MATREGEN CORP. (CA) | 2006-11-23 | — | — | WO | disclosed |
| EP-0782428-A2 | Z-DIRECTION LIQUID TRANSPORT MEDIUM | Kimberly-Clark Worldwide, Inc. (US) | 1997-07-09 | — | — | EP | disclosed |
| WO-1996007384-A2 | Z-DIRECTION LIQUID TRANSPORT MEDIUM | KIMBERLY-CLARK WORLDWIDE, INC. (US) | 1996-03-14 | — | — | WO | disclosed |
| US-5349095-A | Process for preparing hydroxyalkylbenzocyclobutenes | THE DOW CHEMICAL COMPANY (US) | 1994-09-20 | — | — | US | disclosed |
| US-5264613-A | Process for preparing ester of hydroxymethylbenzocyclobutenes | THE DOW CHEMICAL COMPANY (US) | 1993-11-23 | — | — | US | disclosed |
| US-5227536-A | PROCESS FOR PREPARING HYDROXYBENZOCYCLOBUTENES | THE DOW CHEMICAL COMPANY (US) | 1993-07-13 | — | — | US | disclosed |