SCHEMBL5858664

SCHEMBL5858664

[Cu].[Cu].[Cu].[N-3].[N-3].[N-3].[N-3].[N-3].[Ta+5].[Ta+5].[Ta+5].[Ta].[Ta].[Ta]

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL668727 0.87
SCHEMBL4368546 0.87
SCHEMBL611428 0.87
SCHEMBL150753 0.87
SCHEMBL3248410 0.75
SCHEMBL15843897 0.75
SCHEMBL3467470 0.71
SCHEMBL139003 0.71
SCHEMBL6891027 0.71
SCHEMBL9565122 0.71

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 3 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
WO-2003042322-A1 ABRASIVE MEDIA AND AQUEOUS SLURRIES SILBOND CORPORATION (US) 2003-05-22 WO claimed
US-7067914-B2 Dual chip stack method for electro-static discharge protection of integrated circuits INTERNATIONAL BUSINESS MACHINES CORPORATION (US) 2006-06-27 US disclosed
US-20030089979-A1 Dual chip stack method for electro-static discharge protection of integrated circuits INTERNATIONAL BUSINESS MACHINES CORPORATION 2003-05-15 US disclosed