⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL12201166 | 0.84 | — | — | |
| SCHEMBL5860657 | 0.83 | — | — | |
| SCHEMBL12201150 | 0.78 | CYP2C19 (0.35) | — | |
| SCHEMBL12201146 | 0.78 | MGAM (0.36) | — | |
| SCHEMBL4454322 | 0.78 | — | — | |
| SCHEMBL5862013 | 0.78 | — | — | |
| SCHEMBL4089787 | 0.74 | TDP1 (0.35) | — | |
| SCHEMBL9518940 | 0.73 | — | — | |
| SCHEMBL409826 | 0.72 | KMT2A (0.31) | — | |
| Trimethylammonium SCHEMBL27547422 | 0.72 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 5 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-8034403-B2 | Method for forming copper distributing wires | ULVAC, INC. (JP) | 2011-10-11 | — | — | US | disclosed |
| US-20100291290-A1 | Method for forming copper distributing wires | ULVAC, INC. (JP) | 2010-11-18 | — | — | US | disclosed |
| US-20090098290-A1 | Process for formation of copper-containing films | ULVAC, INC. (JP) | 2009-04-16 | — | — | US | disclosed |
| US-6992200-B2 | Copper complexes and process for formation of copper-containing thin films by using the same | UBE INDUSTRIES, LTD. (JP) | 2006-01-31 | — | — | US | disclosed |
| US-20050080282-A1 | Copper complexes and process for formatiom of copper-containing thin films by using the same | UBE INDSTRIES, LTD. (JP) | 2005-04-14 | — | — | US | disclosed |