SCHEMBL4089787

SCHEMBL4089787

CCC(=O)CC(=O)C(C)(C)O[Si](C)(C)C

nearest known ligand 0.35

Predicted protein targets (top 1)

geneUniProtsupporting neighboursconfidence
TDP1 Q9NUW8 1/20 0.35

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL5860657 0.85
SCHEMBL9518940 0.83
SCHEMBL12201150 0.79 CYP2C19 (0.35) TDP1
SCHEMBL5862013 0.79
SCHEMBL12201146 0.79 MGAM (0.36)
SCHEMBL5859583 0.74
SCHEMBL6191647 0.72 TRPA1 (0.32)
SCHEMBL407289 0.71 TDP1 (0.47) TDP1
SCHEMBL15658553 0.67 TDP1 (0.43) TDP1
SCHEMBL14666320 0.67 TDP1 (0.43) TDP1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 3 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-1811059-B1 PROCESS FOR FORMATION OF COPPER-CONTAINING FILM ULVAC INC (JP) 2012-10-31 EP disclosed
US-20090098290-A1 Process for formation of copper-containing films ULVAC, INC. (JP) 2009-04-16 US disclosed
EP-1811059-A1 PROCESS FOR FORMATION OF COPPER-CONTAINING FILM ULVAC, INC. (JP) 2007-07-25 EP disclosed