SCHEMBL12201146

SCHEMBL12201146

CC(=O)CC(=O)C(C)(C)O[Si](C)(C)C

nearest known ligand 0.36

Predicted protein targets (top 5)

geneUniProtsupporting neighboursconfidence
MGAM O43451 1/20 0.36
GAA P10253 1/20 0.36
SI P14410 1/20 0.36
MGAM2 Q2M2H8 1/20 0.36
HTT P42858 1/20 0.33

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL5860657 0.89
SCHEMBL5862013 0.83
SCHEMBL4089787 0.79 TDP1 (0.35)
SCHEMBL5859583 0.78
SCHEMBL9518940 0.77
SCHEMBL6191647 0.76 TRPA1 (0.32)
SCHEMBL12201150 0.75 CYP2C19 (0.35)
SCHEMBL17731296 0.75 GAA (0.46) MGAMGAASIMGAM2HTT
SCHEMBL5806950 0.74 GAA (0.32) GAA
SCHEMBL4085493 0.70 DGAT1 (0.39)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 3 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-8034403-B2 Method for forming copper distributing wires ULVAC, INC. (JP) 2011-10-11 US disclosed
US-20100291290-A1 Method for forming copper distributing wires ULVAC, INC. (JP) 2010-11-18 US disclosed
US-20090098290-A1 Process for formation of copper-containing films ULVAC, INC. (JP) 2009-04-16 US disclosed