SCHEMBL12201150

SCHEMBL12201150

CC(C)CC(=O)CC(=O)C(C)(C)O[Si](C)(C)C

nearest known ligand 0.35

Predicted protein targets (top 8)

geneUniProtsupporting neighboursconfidence
CYP2C19 P33261 1/20 0.35
ALDH1A1 P00352 1/20 0.31
TDP1 Q9NUW8 1/20 0.31
MMP1 P03956 1/20 0.31
MMP2 P08253 1/20 0.31
MMP3 P08254 1/20 0.31
MMP9 P14780 1/20 0.31
MMP13 P45452 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL5860657 0.80
SCHEMBL4089787 0.79 TDP1 (0.35) TDP1
SCHEMBL5859583 0.78
SCHEMBL12201146 0.75 MGAM (0.36)
SCHEMBL5862013 0.75
SCHEMBL1262761 0.74 CYP2C19 (0.43) CYP2C19ALDH1A1TDP1
SCHEMBL28008804 0.72 CYP2C19 (0.42) CYP2C19ALDH1A1TDP1
SCHEMBL23009498 0.71 CYP2C19 (0.41) CYP2C19ALDH1A1TDP1
SCHEMBL11974569 0.71 CYP2C19 (0.41) CYP2C19ALDH1A1TDP1
SCHEMBL9518940 0.70

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 3 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-8034403-B2 Method for forming copper distributing wires ULVAC, INC. (JP) 2011-10-11 US disclosed
US-20100291290-A1 Method for forming copper distributing wires ULVAC, INC. (JP) 2010-11-18 US disclosed
US-20090098290-A1 Process for formation of copper-containing films ULVAC, INC. (JP) 2009-04-16 US disclosed