SCHEMBL5953384

SCHEMBL5953384

Cc1ccc(C(c2ccc(O)c(C)c2)(c2ccc(O)c(C)c2)c2ccc(O)c(C)c2)c(-c2ccc(O)c(C)c2)c1

nearest known ligand 0.48

Predicted protein targets (top 13)

geneUniProtsupporting neighboursconfidence
TP53 P04637 1/20 0.48
TDP1 Q9NUW8 1/20 0.48
ESR1 P03372 9/20 0.44
ESR2 Q92731 7/20 0.42
AR P10275 3/20 0.42
TLR8 Q9NR97 2/20 0.39
HSD17B1 P14061 4/20 0.39
HSD17B2 P37059 4/20 0.39
CYP3A4 P08684 1/20 0.38
CYP2D6 P10635 1/20 0.38
CYP2C19 P33261 1/20 0.38
TRPA1 O75762 1/20 0.37
IDO1 P14902 1/20 0.36

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL6333440 0.84 ESR2 (0.39) TP53TDP1ESR1ESR2HSD17B1
SCHEMBL6334648 0.84 ALOX15 (0.42) TP53TDP1ESR1ESR2TRPA1
SCHEMBL6336529 0.84 KDM4E (0.39) ESR1ESR2HSD17B1HSD17B2CYP3A4
SCHEMBL6342106 0.84 RARB (0.42) TP53TDP1ESR1ESR2HSD17B2
SCHEMBL6333099 0.81 CNR2 (0.43) TDP1ESR1ESR2HSD17B1HSD17B2
SCHEMBL18763597 0.79 TDP1 (0.64) TP53TDP1ESR1ESR2TLR8
SCHEMBL2954728 0.79 MAOB (0.41) ESR1ESR2ARCYP3A4
SCHEMBL20136961 0.78 TP53 (0.61) TP53TDP1ESR1ESR2TLR8
SCHEMBL673977 0.73 ESR1 (0.70) TP53TDP1ESR1ESR2AR
SCHEMBL6701961 0.72 HSD17B1 (0.46) ESR1ESR2ARTLR8HSD17B1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 6 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-4426513-A Polycarbonate resins based on polyphenolic compounds GENERAL ELECTRIC COMPANY (US) 1984-01-17 US claimed
US-7122613-B1 Method for the production of polycarbonates GENERAL ELECTRIC COMPANY (US) 2006-10-17 US disclosed
US-20050228167-A1 Molecular compounds containing polymers having hydrogen bond sites as the constituent compounds NIPPON SODA CO., LTD. (JP) 2005-10-13 US disclosed
US-20040152022-A1 Resist remover composition DONGJIN SEMICHEM CO., LTD. (KR) 2004-08-05 US disclosed
US-6222004-B1 MOLDABILITY IN BLOW MOLDING; APPEARANCE AND COLOR TONE IDEMITSU PETROCHEMICAL CO., LTD (JP) 2001-04-24 US disclosed
US-4426513-A Polycarbonate resins based on polyphenolic compounds GENERAL ELECTRIC COMPANY (US) 1984-01-17 US disclosed