SCHEMBL596121

SCHEMBL596121

C=Cc1cccc(-c2cccc(-c3cccc(C=C)c3)c2)c1

nearest known ligand 0.56

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
TP53 P04637 1/20 0.56
TDP1 Q9NUW8 1/20 0.56
PTGS2 P35354 1/20 0.51
ALDH1A1 P00352 3/20 0.50
TSHR P16473 1/20 0.50
MEN1 O00255 1/20 0.39
ESR1 P03372 1/20 0.39
KMT2A Q03164 1/20 0.39
TRIM24 O15164 1/20 0.38
TRIM33 Q9UPN9 1/20 0.38
CA12 O43570 1/20 0.37
CA1 P00915 1/20 0.37
CA2 P00918 1/20 0.37
CA9 Q16790 1/20 0.37
APP P05067 1/20 0.37
TGFBR1 P36897 1/20 0.37
HDAC8 Q9BY41 2/20 0.37
KCNH2 Q12809 1/20 0.36
CYP3A4 P08684 2/20 0.34
CYP2C9 P11712 2/20 0.34

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL30485440 0.97 TP53 (0.58) TP53TDP1PTGS2ALDH1A1TSHR
SCHEMBL585196 0.97 TP53 (0.58) TP53TDP1PTGS2ALDH1A1TSHR
SCHEMBL8757855 0.93 ALDH1A1 (0.56) TP53TDP1PTGS2ALDH1A1TSHR
SCHEMBL595061 0.92 PTGS2 (0.59) TP53TDP1PTGS2ALDH1A1TSHR
SCHEMBL594416 0.91 PTGS2 (0.54) TP53TDP1PTGS2ALDH1A1TSHR
SCHEMBL714226 0.90 ALDH1A1 (0.59) TP53TDP1PTGS2ALDH1A1TSHR
SCHEMBL30618844 0.90 ALDH1A1 (0.59) TP53TDP1PTGS2ALDH1A1TSHR
SCHEMBL4257518 0.88 PTGS2 (0.56) TP53TDP1PTGS2ALDH1A1TSHR
SCHEMBL2095987 0.88 PTGS2 (0.56) TP53TDP1PTGS2ALDH1A1TSHR
Styrene SCHEMBL9129912 0.88 ALDH1A1 (0.64) TP53TDP1PTGS2ALDH1A1TSHR

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 10 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-4632012-A1 RESIN COMPOSITION, PREPREG, METAL FOIL-CLAD LAMINATE, AND PRINTED SUBSTRATE Zeon Corporation (JP) 2025-10-15 EP disclosed
WO-2025126839-A1 RESIN COMPOSITION, ADHESIVE AGENT, SEALING MATERIAL, CURED PRODUCT, SEMICONDUCTOR DEVICE, AND ELECTRONIC COMPONENT ナミックス株式会社 2025-06-19 WO disclosed
WO-2024122426-A1 RESIN COMPOSITION, PREPREG, METAL FOIL-CLAD LAMINATE, AND PRINTED SUBSTRATE 日本ゼオン株式会社 2024-06-13 WO disclosed
US-8227361-B2 Prepreg and printed wiring board using thin quartz glass cloth HITACHI CHEMICAL COMPANY, LTD. (JP) 2012-07-24 US disclosed
US-8115105-B2 Prepreg and its application products for low thermal expansion and low dielectric tangent HITACHI CHEMICAL CO., LTD. (JP) 2012-02-14 US disclosed
US-7638564-B2 Low dielectric loss tangent-resin varnish, prepreg, laminated sheet, and printed wiring board using the varnish HITACHI CHEMICAL CO., LTD. (JP) 2009-12-29 US disclosed
US-20090266591-A1 Prepreg and printed wiring board using thin quartz glass cloth RESONAC CORPORATION (JP) 2009-10-29 US disclosed
US-20090178832-A1 PREPREG AND ITS APPLICATION PRODUCTS FOR LOW THERMAL EXPANSION AND LOW DIELECTRIC TANGENT HITACHI CHEMICAL CO.., LTD. 2009-07-16 US disclosed
US-20080261472-A1 PREPREG, MULTILAYER PRINTED WIRING BOARD AND ELECTRONIC PARTS USING THE SAME HITACHI CHEMICAL CO., LTD. 2008-10-23 US disclosed
US-20070077413-A1 Low dielectric loss tangent-resin varnish, prepreg, laminated sheet, and printed wiring board using the varnish HITACHI CHEMICAL CO., LTD. (JP) 2007-04-05 US disclosed