SCHEMBL598024

SCHEMBL598024

O=S(=O)(OS(c1ccccc1)(c1ccccc1)c1ccccc1)c1cccc2ccccc12

nearest known ligand 0.50

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
CA1 P00915 1/20 0.50
CA2 P00918 1/20 0.50
CA9 Q16790 1/20 0.50
HTR6 P50406 3/20 0.46
RECQL P46063 1/20 0.44
PGR P06401 1/20 0.43
F2 P00734 3/20 0.42
PRSS1 P07477 3/20 0.42
PRSS2 P07478 3/20 0.42
PRSS3 P35030 3/20 0.42
MEN1 O00255 2/20 0.41
KMT2A Q03164 2/20 0.41
TSHR P16473 1/20 0.40
KEAP1 Q14145 1/20 0.39
NFE2L2 Q16236 1/20 0.39
NR4A1 P22736 1/20 0.39
NR4A2 P43354 1/20 0.39
NR4A3 Q92570 1/20 0.39
ALDH1A1 P00352 1/20 0.39
MAPT P10636 1/20 0.39

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL6762786 0.88 CA1 (0.42) CA1CA2CA9HTR6RECQL
SCHEMBL10766580 0.88 CA1 (0.52) CA1CA2CA9HTR6RECQL
SCHEMBL12095552 0.87 HTR6 (0.45) CA1CA2CA9HTR6PGR
SCHEMBL2323729 0.85 CA1 (0.61) CA1CA2CA9HTR6PGR
SCHEMBL31286100 0.85 CA1 (0.61) CA1CA2CA9HTR6PGR
SCHEMBL6765040 0.83 PGR (0.40) CA1CA2CA9HTR6RECQL
SCHEMBL11440044 0.82 CA1 (0.57) CA1CA2CA9HTR6PGR
SCHEMBL450357 0.81 ALDH1A1 (0.38) RECQLF2PRSS1PRSS2PRSS3
SCHEMBL3137513 0.81 HTR6 (0.42) CA1CA2CA9HTR6F2
SCHEMBL3141040 0.81 CA1 (0.41) CA1CA2CA9HTR6RECQL

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 419 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20140335448-A1 PHOTOSENSITIVE SILOXANE RESIN COMPOSITION AZ ELECTRONIC MATERIALS USA CORP. (US) 2014-11-13 US claimed
US-RE37179-E1 ADDITION POLYMER JSR CORPORATION (JP) 2001-05-15 US claimed
US-5994022-A BECOMES SOLUBLE IN ALKALI DEVELOPING SOLUTION BY ACTION OF AN ACID JSR CORPORATION (JP) 1999-11-30 US claimed
US-5679495-A TERPOLYMER PHOTORESIST CONTAINING VINYLPHENOL DERIVATIVE, TERT-BUTYL (METH)ACRYLATE, AND A UNIT TO REDUCE ALKALINE SOLUBILITY; DRY ETCH RESISTANCE JAPAN SYNTHETIC RUBBER CO., LTD. (JP) 1997-10-21 US claimed
CN-122043858-A EUV patterned resist formation method 亚历克斯·P·G·罗宾逊 2026-05-15 CN disclosed
CN-120077771-A Curable composition for organic EL element, cured product for organic EL element, method for producing cured product for organic EL element, and polymer JSR株式会社 2025-05-30 CN disclosed
WO-2025062940-A1 RESIN COMPOSITION, SUBSTRATE WITH PIEZOELECTRIC FILM, AND METHOD FOR PRODUCING SUBSTRATE WITH PIEZOELECTRIC FILM 東レ株式会社 2025-03-27 WO disclosed
CN-110850680-B Curable composition, display element, and method for forming cured film JSR株式会社 2024-10-25 CN disclosed
US-20240168383-A1 STRUCTURE FOR OPTICAL DEVICES, PROCESS FOR PREPARING THE SAME, AND PHOTOCURABLE SILOXANE RESIN COMPOSITION THEREFOR DUPONT SPECIALTY MATERIALS KOREA LTD (KR) 2024-05-23 US disclosed
CN-114690562-A Structure for optical device, method for preparing the same, and photocurable silicone resin composition for the same 罗门哈斯电子材料韩国有限公司 2022-07-01 CN disclosed
CN-113994256-A Method for forming EUV patterned resist 亚历克斯·P·G·罗宾逊 2022-01-28 CN disclosed
WO-2021106537-A1 RESIST UNDERLAYER FILM-FORMING COMPOSITION, PATTERN FORMING METHOD, AND ELECTRONIC DEVICE MANUFACTURING METHOD 富士フイルム株式会社 2021-06-03 WO disclosed
EP-0660187-B1 Radiation-sensitive resin composition JAPAN SYNTHETIC RUBBER CO LTD (JP) 1997-03-05 EP disclosed
US-5558971-A HYDROXYSTYRENE POLYMER DERIVATIVES, PHOTOACID GENERATOR WAKO PURE CHEMICAL INDUSTRIES, LTD. (JP) 1996-09-24 US disclosed
US-5558976-A HYDROXYSTYRENE POLYMER DERIVATIVES, PHOTOACID GENERATOR, PHOTORESISTS WAKO PURE CHEMICAL INDUSTRIES, LTD. (JP) 1996-09-24 US disclosed
US-5556734-A RESISTS JAPAN SYNTHETIC RUBBER CO., LTD. (JP) 1996-09-17 US disclosed
EP-0726500-A1 Chemically amplified, radiation-sensitive resin composition JAPAN SYNTHETIC RUBBER CO., LTD. (JP) 1996-08-14 EP disclosed
EP-0704762-A1 Resist material and pattern formation WAKO PURE CHEMICAL INDUSTRIES LTD (JP) 1996-04-03 EP disclosed
EP-0660187-A1 Radiation-sensitive resin composition JAPAN SYNTHETIC RUBBER CO., LTD. (JP) 1995-06-28 EP disclosed
EP-0634696-A1 Chemically amplified resist composition JAPAN SYNTHETIC RUBBER CO., LTD. (JP) 1995-01-18 EP disclosed