SCHEMBL6003717

SCHEMBL6003717

Nc1ccc(C(Br)(Br)c2ccc(N)cc2)cc1

nearest known ligand 0.53

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
MAPT P10636 5/20 0.53
MEN1 O00255 2/20 0.53
KMT2A Q03164 2/20 0.53
KIF11 P52732 1/20 0.48
ALDH1A1 P00352 7/20 0.47
MAPK1 P28482 3/20 0.47
ALOX15 P16050 2/20 0.47
CYP3A4 P08684 6/20 0.44
TDP1 Q9NUW8 6/20 0.44
TP53 P04637 1/20 0.44
NPC1 O15118 3/20 0.42
RAB9A P51151 3/20 0.42
HPGD P15428 1/20 0.42
HSD17B10 Q99714 2/20 0.40
ACHE P22303 1/20 0.40
CA3 P07451 1/20 0.40
THRB P10828 1/20 0.40
CA6 P23280 1/20 0.40
CASP1 P29466 1/20 0.40
HIF1A Q16665 1/20 0.40

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL3879234 0.80 MAPT (0.53) MAPTMEN1KMT2AKIF11ALDH1A1
SCHEMBL676983 0.78 KIF11 (0.52) MAPTMEN1KMT2AKIF11ALDH1A1
SCHEMBL791664 0.76 MAPT (0.57) MAPTMEN1KMT2AKIF11ALDH1A1
SCHEMBL9456971 0.76 MAPT (0.57) MAPTMEN1KMT2AKIF11ALDH1A1
SCHEMBL320609 0.73 MEN1 (1.00) MAPTMEN1KMT2AALDH1A1MAPK1
SCHEMBL27981 0.73
SCHEMBL13149674 0.71 ALDH1A1 (0.68) MAPTMEN1KMT2AKIF11ALDH1A1
SCHEMBL13149665 0.71 ALDH1A1 (0.68) MAPTMEN1KMT2AKIF11ALDH1A1
SCHEMBL126726 0.71 CYP3A4 (0.52) MAPTMEN1KMT2AKIF11ALDH1A1
SCHEMBL10302 0.71 KIF11 (0.84) MAPTMEN1KMT2AKIF11ALDH1A1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 6 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-110662795-B Prepreg, method for producing same, laminate, printed wiring board, and semiconductor package 昭和电工材料株式会社 2022-12-06 CN disclosed
CN-110678505-B Method for producing prepreg, laminated board, printed wiring board, and semiconductor package 昭和电工材料株式会社 2022-08-23 CN disclosed
CN-110678505-A Method for producing prepreg, laminate, printed wiring board, and semiconductor package 日立化成株式会社 2020-01-10 CN disclosed
CN-110662795-A Prepreg, method for producing same, laminate, printed wiring board, and semiconductor package 日立化成株式会社 2020-01-07 CN disclosed
US-20060251379-A1 Optical element, process for producing optical element, coating equipment, and coating method KURODA TOSHIHIRO 2006-11-09 US disclosed
EP-0405329-A1 Adhesive stick having improved adhesive band strength Henkel Kommanditgesellschaft auf Aktien (DE) 1991-01-02 EP disclosed