Predicted protein targets (top 1)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | LMNA | P02545 | 1/20 | 0.32 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL31135447 | 0.94 | LMNA (0.32) | LMNA | |
| SCHEMBL10903370 | 0.87 | — | — | |
| SCHEMBL31135452 | 0.80 | LMNA (0.30) | LMNA | |
| SCHEMBL28738694 | 0.78 | — | — | |
| SCHEMBL596303 | 0.76 | — | — | |
| SCHEMBL28179363 | 0.74 | — | — | |
| SCHEMBL833622 | 0.74 | — | — | |
| SCHEMBL1050532 | 0.74 | ADRB2 (0.35) | — | |
| SCHEMBL35058 | 0.73 | — | — | |
| SCHEMBL108892 | 0.73 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 162 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-4954534-A | HIGH SPEED LOW TEMPERATURE SETTING | RICOH COMPANY, LTD. (JP) | 1990-09-04 | — | — | US | claimed |
| EP-0076102-B1 | PHOTOPOLYMERIZABLE COMPOSITION BASED ON EPOXY COMPOUND | KABUSHIKI KAISHA TOSHIBA (JP) | 1985-03-20 | — | — | EP | claimed |
| US-4437959-A | Photopolymerizable composition based on epoxy compound | TOKYO SHIBAURA DENKI KABUSHIKI KAISHA (JP) | 1984-03-20 | — | — | US | claimed |
| EP-0076102-A1 | Photopolymerizable composition based on epoxy compound | KABUSHIKI KAISHA TOSHIBA (JP) | 1983-04-06 | — | — | EP | claimed |
| US-12403437-B2 | Method for producing nanodiamonds doped with group 14 element, and method for purifying same | DAICEL CORPORATION (JP) | 2025-09-02 | — | — | US | disclosed |
| US-12351463-B2 | Heteroatom-doped nanodiamond | DAICEL CORPORATION (JP) | 2025-07-08 | — | — | US | disclosed |
| CN-113631252-B | Method for producing and purifying nanodiamond doped with carbon group element | 株式会社大赛璐 | 2025-05-23 | — | — | CN | disclosed |
| WO-2025041519-A1 | PHOTOSENSITIVE RESIN COMPOSITION AND CURED PRODUCT OF SAME | 日本化薬株式会社 | 2025-02-27 | — | — | WO | disclosed |
| US-20250002355-A1 | HETEROATOM-DOPED NANODIAMOND PARTICLES AND METHOD FOR PRODUCING HETEROATOM-DOPED NANODIAMOND PARTICLES | DAICEL CORPORATION (JP) | 2025-01-02 | — | — | US | disclosed |
| EP-4382481-A1 | HETEROATOM-DOPED NANODIAMOND PARTICLES AND METHOD FOR PRODUCING HETEROATOM-DOPED NANODIAMOND PARTICLES | Daicel Corporation (JP) | 2024-06-12 | — | — | EP | disclosed |
| US-20240168380-A1 | Photosensitive Resin Composition And Cured Product Therefrom | NIPPON KAYAKU KABUSHIKI KAISHA (JP) | 2024-05-23 | — | — | US | disclosed |
| CN-117794856-A | Heteroatom-doped nanodiamond particles and method for producing heteroatom-doped nanodiamond particles | 株式会社大赛璐 | 2024-03-29 | — | — | CN | disclosed |
| US-4495042-A | Photo-curable epoxy resin composition | TOKYO SHIBAURA DENKI KABUSHIKI KAISHA (JP) | 1985-01-22 | — | — | US | disclosed |
| EP-0123842-A1 | Photo-curable epoxy resin type composition | KABUSHIKI KAISHA TOSHIBA (JP) | 1984-11-07 | — | — | EP | disclosed |
| US-4479860-A | ORGANOALUMINUM COMPOUND AND PEROXYSILYL COMPOUND AS HARDENING CATALYST | TOKYO SHIBAURA DENKI KABUSHIKI KAISHA (JP) | 1984-10-30 | — | — | US | disclosed |
| EP-0114258-A1 | Resin encapsulation type photo-semiconductor devices | KABUSHIKI KAISHA TOSHIBA (JP) | 1984-08-01 | — | — | EP | disclosed |
| US-4437959-A | Photopolymerizable composition based on epoxy compound | TOKYO SHIBAURA DENKI KABUSHIKI KAISHA (JP) | 1984-03-20 | — | — | US | disclosed |
| US-4406764-A | Photo-curable epoxy resin composition with organic aluminum and α-ketosilyl compounds | TOKYO SHIBAURA DENKI KABUSHIKI KAISHA (JP) | 1983-09-27 | — | — | US | disclosed |
| EP-0076102-A1 | Photopolymerizable composition based on epoxy compound | KABUSHIKI KAISHA TOSHIBA (JP) | 1983-04-06 | — | — | EP | disclosed |
| EP-0057018-A2 | Photo-curable epoxy resin composition | KABUSHIKI KAISHA TOSHIBA (JP) | 1982-08-04 | — | — | EP | disclosed |