SCHEMBL601233

SCHEMBL601233

COc1cccc(-c2c3ccccc3nc3ccccc23)c1

nearest known ligand 0.64

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
CYP1A2 P05177 7/20 0.64
CYP3A4 P08684 7/20 0.64
CYP2C9 P11712 4/20 0.64
CYP2B6 P20813 2/20 0.64
AHR P35869 2/20 0.64
NR1I3 Q14994 2/20 0.64
VDR P11473 1/20 0.64
ADORA2A P29274 1/20 0.62
CYP2D6 P10635 6/20 0.59
MAPK1 P28482 5/20 0.59
KMT2A Q03164 4/20 0.59
USP2 O75604 4/20 0.59
CYP2C19 P33261 4/20 0.59
CLK4 Q9HAZ1 4/20 0.59
ALDH1A1 P00352 3/20 0.59
HSD17B10 Q99714 3/20 0.59
ALOX15 P16050 2/20 0.59
HPGD P15428 2/20 0.59
F2 P00734 1/20 0.59
MAPT P10636 3/20 0.57

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL29587463 1.00 CYP1A2 (0.64) CYP1A2CYP3A4CYP2C9CYP2B6AHR
SCHEMBL32679263 0.85 ESR1 (0.63) CYP1A2CYP3A4CYP2C9CYP2B6AHR
SCHEMBL28364890 0.85 ESR1 (0.63) CYP1A2CYP3A4CYP2C9CYP2B6AHR
SCHEMBL29043030 0.85 ESR1 (0.63) CYP1A2CYP3A4CYP2C9CYP2B6AHR
SCHEMBL28669752 0.83 ALOX5 (0.60) CYP1A2CYP3A4CYP2C9CYP2B6AHR
SCHEMBL602200 0.83 SMN1; SMN2 (0.62) MAPK1KMT2AUSP2ALDH1A1HSD17B10
SCHEMBL29587729 0.83 SMN1; SMN2 (0.62) MAPK1KMT2AUSP2ALDH1A1HSD17B10
SCHEMBL31061121 0.82 CYP1A2 (0.63) CYP1A2CYP3A4CYP2C9CYP2B6AHR
SCHEMBL304562 0.81 KDM4E (0.61) CYP1A2CYP2C9ADORA2AKMT2ACYP2C19
SCHEMBL29834187 0.80 MAPT (0.64) CYP1A2CYP3A4CYP2C9CYP2D6KMT2A

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 39 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-110357989-B Tertiary amine photosensitizer, preparation method thereof, photosensitive resin composition containing tertiary amine photosensitizer and application of photosensitive resin composition 常州强力电子新材料股份有限公司 2022-04-22 CN claimed
CN-108241259-B Resist composition with good hole masking function and capable of directly depicting, exposing and imaging 杭州福斯特电子材料有限公司 2021-08-10 CN claimed
CN-110357989-A Tertiary amine photosensitizer, preparation method, comprising its photosensitive polymer combination and photosensitive polymer combination application 常州强力电子新材料股份有限公司 2019-10-22 CN claimed
CN-109976095-A It is a kind of directly to describe the anti-corrosion agent composition and layered product being imaged by light 杭州福斯特应用材料股份有限公司 2019-07-05 CN claimed
CN-108241259-A A kind of anti-corrosion agent composition that can directly describe exposure image with good hole masking function 浙江福斯特新材料研究院有限公司 2018-07-03 CN claimed
US-5346805-A Initiator comprising an onium compound and an acridine derivative; printing plate, resist, photomask FUJI PHOTO FILM CO., LTD. (JP) 1994-09-13 US claimed
US-4587200-A Photopolymerizable composition comprising an acridine and a heterocyclic thiol compound as a photopolymerization initiator and a photographic process using said photopolymerizable composition FUJI PHOTO FILM CO., LTD. (JP) 1986-05-06 US claimed
CN-113156764-B Photosensitive resin composition and resist laminate 杭州福斯特电子材料有限公司 2024-04-26 CN disclosed
CN-111315828-B Composition, cured product, optical filter, and method for producing cured product 株式会社艾迪科 2023-09-29 CN disclosed
CN-112154167-B Composition, cured product, optical filter, and method for producing cured product 株式会社艾迪科 2023-08-22 CN disclosed
CN-115047714-A Resist composition and laminate thereof 杭州福斯特电子材料有限公司 2022-09-13 CN disclosed
CN-110114376-B Curable composition, method for producing cured product, cured product thereof, and adhesive using same 株式会社ADEKA 2022-06-14 CN disclosed
CN-110357989-B Tertiary amine photosensitizer, preparation method thereof, photosensitive resin composition containing tertiary amine photosensitizer and application of photosensitive resin composition 常州强力电子新材料股份有限公司 2022-04-22 CN disclosed
CN-102844709-A Photosensitive resin composition, photoresist film using same, method for forming resist pattern, and method for manufacturing printed wiring board NICHIGO MORTON CO LTD 2012-12-26 CN disclosed
US-20120040290-A1 PHOTOSENSITIVE RESIN COMPOSITION, AND PHOTOSENSITIVE ELEMENT, RESIST PATTERN FORMATION METHOD AND PRINTED CIRCUIT BOARD PRODUCTION METHOD EACH UTILIZING SAME HITACHI CHEMICAL COMPANY, LTD. (JP) 2012-02-16 US disclosed
CN-102341753-A Photosensitive resin composition, and photosensitive element, resist pattern formation method and printed circuit board production method each utilizing same HITACHI CHEMICAL CO LTD 2012-02-01 CN disclosed
CN-101779165-A Photosensitive resin composition and laminate thereof ASAHI KASEI EMD CORP 2010-07-14 CN disclosed
US-20100159691-A1 PHOTOSENSITIVE RESIN COMPOSITION AND LAMINATE ASAHI KASEI EMD CORPORATION (JP) 2010-06-24 US disclosed
US-5346805-A Initiator comprising an onium compound and an acridine derivative; printing plate, resist, photomask FUJI PHOTO FILM CO., LTD. (JP) 1994-09-13 US disclosed
US-4587200-A Photopolymerizable composition comprising an acridine and a heterocyclic thiol compound as a photopolymerization initiator and a photographic process using said photopolymerizable composition FUJI PHOTO FILM CO., LTD. (JP) 1986-05-06 US disclosed