SCHEMBL601489

SCHEMBL601489

CCCCc1ccc(-c2c3ccccc3nc3ccccc23)cc1

nearest known ligand 0.58

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
DHODH Q02127 1/20 0.58
HSD11B1 P28845 2/20 0.53
KDM4E B2RXH2 2/20 0.50
ALDH1A1 P00352 1/20 0.50
GAA P10253 1/20 0.50
HPGD P15428 1/20 0.50
PARP1 P09874 1/20 0.47
ESR1 P03372 2/20 0.46
ESR2 Q92731 2/20 0.46
PDE10A Q9Y233 1/20 0.46
PSMB5 P28074 1/20 0.46
TLR7 Q9NYK1 1/20 0.45
RARB P10826 1/20 0.45
ADORA3 P0DMS8 3/20 0.45
NUDT1 P36639 1/20 0.45
PDE4A P27815 1/20 0.45
PDE4B Q07343 1/20 0.45
PDE4C Q08493 1/20 0.45
PDE4D Q08499 1/20 0.45
CTSV O60911 1/20 0.45

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL29488276 1.00 DHODH (0.58) DHODHHSD11B1KDM4EALDH1A1GAA
SCHEMBL10476827 0.94 HSD11B1 (0.52) DHODHHSD11B1KDM4EALDH1A1GAA
SCHEMBL13156610 0.93 DHODH (0.55) DHODHHSD11B1KDM4EALDH1A1GAA
SCHEMBL29488287 0.90 KDM4E (0.58) DHODHHSD11B1KDM4EALDH1A1GAA
SCHEMBL600665 0.90 KDM4E (0.58) DHODHHSD11B1KDM4EALDH1A1GAA
SCHEMBL29587930 0.83 PSMB5 (0.49) DHODHHSD11B1KDM4EALDH1A1GAA
SCHEMBL600671 0.83 PSMB5 (0.49) DHODHHSD11B1KDM4EALDH1A1GAA
SCHEMBL601192 0.83 ESR1 (0.51) KDM4EALDH1A1GAAHPGDESR1
SCHEMBL29488280 0.83 ESR1 (0.51) KDM4EALDH1A1GAAHPGDESR1
Heptane SCHEMBL27733566 0.83 ESR1 (0.56) KDM4EALDH1A1GAAHPGDESR1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 59 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-110357989-B Tertiary amine photosensitizer, preparation method thereof, photosensitive resin composition containing tertiary amine photosensitizer and application of photosensitive resin composition 常州强力电子新材料股份有限公司 2022-04-22 CN claimed
CN-108241259-B Resist composition with good hole masking function and capable of directly depicting, exposing and imaging 杭州福斯特电子材料有限公司 2021-08-10 CN claimed
CN-110357989-A Tertiary amine photosensitizer, preparation method, comprising its photosensitive polymer combination and photosensitive polymer combination application 常州强力电子新材料股份有限公司 2019-10-22 CN claimed
CN-109976095-A It is a kind of directly to describe the anti-corrosion agent composition and layered product being imaged by light 杭州福斯特应用材料股份有限公司 2019-07-05 CN claimed
CN-108241259-A A kind of anti-corrosion agent composition that can directly describe exposure image with good hole masking function 浙江福斯特新材料研究院有限公司 2018-07-03 CN claimed
US-5346805-A Initiator comprising an onium compound and an acridine derivative; printing plate, resist, photomask FUJI PHOTO FILM CO., LTD. (JP) 1994-09-13 US claimed
US-4587200-A Photopolymerizable composition comprising an acridine and a heterocyclic thiol compound as a photopolymerization initiator and a photographic process using said photopolymerizable composition FUJI PHOTO FILM CO., LTD. (JP) 1986-05-06 US claimed
US-12353130-B2 Photosensitive resin composition and photosensitive resin multilayer body ASAHI KASEI KABUSHIKI KAISHA (JP) 2025-07-08 US disclosed
WO-2025018412-A1 PHOTOSENSITIVE ELEMENT, PHOTOSENSITIVE ELEMENT ROLL, METHOD FOR FORMING RESIST PATTERN, AND METHOD FOR FORMING CONDUCTOR PATTERN 旭化成株式会社 2025-01-23 WO disclosed
US-20240408595-A1 STRUCTURE COMPRISING MICROCHANNEL, PRODUCTION METHOD FOR SAID STRUCTURE, AND MICROCHANNEL DEVICE ASAHI KASEI KABUSHIKI KAISHA (JP) 2024-12-12 US disclosed
US-12032286-B2 Method for producing multi-layered type microchannel device using photosensitive resin laminate ASAHI KASEI KABUSHIKI KAISHA (JP) 2024-07-09 US disclosed
CN-113156764-B Photosensitive resin composition and resist laminate 杭州福斯特电子材料有限公司 2024-04-26 CN disclosed
US-20240059803-A1 PHOTOSENSITIVE RESIN MULTILAYER BODY AND METHOD FOR PRODUCING SAME ASAHI KASEI KABUSHIKI KAISHA (JP) 2024-02-22 US disclosed
CN-101449208-B Photosensitive resin composition and laminate ASAHI KASEI E-MATERIALS CORP. (JP) 2011-12-14 CN disclosed
CN-101779165-A Photosensitive resin composition and laminate thereof ASAHI KASEI EMD CORP 2010-07-14 CN disclosed
US-20100159691-A1 PHOTOSENSITIVE RESIN COMPOSITION AND LAMINATE ASAHI KASEI EMD CORPORATION (JP) 2010-06-24 US disclosed
CN-101568882-A Photosensitive resin composition and laminate ASAHI KASEI EMD CORP (JP) 2009-10-28 CN disclosed
CN-101449208-A Photosensitive resin composition and laminate ASAHI KASEI EMD CORP (JP) 2009-06-03 CN disclosed
US-5346805-A Initiator comprising an onium compound and an acridine derivative; printing plate, resist, photomask FUJI PHOTO FILM CO., LTD. (JP) 1994-09-13 US disclosed
US-4587200-A Photopolymerizable composition comprising an acridine and a heterocyclic thiol compound as a photopolymerization initiator and a photographic process using said photopolymerizable composition FUJI PHOTO FILM CO., LTD. (JP) 1986-05-06 US disclosed