SCHEMBL6060644

SCHEMBL6060644

Cc1cc(S)ccc1Oc1ccc(S)cc1C

nearest known ligand 0.35

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
▸ SLC6A4 P31645 6/20 0.35
▸ SLC6A2 P23975 5/20 0.35
▸ SLC6A3 Q01959 3/20 0.35
▸ AR P10275 2/20 0.33
▸ HTR1A P08908 2/20 0.33
▸ HTR3A P46098 2/20 0.33
▸ CYP1A2 P05177 1/20 0.33
▸ CYP3A4 P08684 1/20 0.33
▸ CYP2C19 P33261 1/20 0.33
▸ NTRK1 P04629 1/20 0.32
▸ IGF1R P08069 1/20 0.32
▸ FGFR1 P11362 1/20 0.32
▸ NTRK2 Q16620 1/20 0.32
▸ MAPT P10636 2/20 0.31
▸ MEN1 O00255 2/20 0.31
▸ KMT2A Q03164 2/20 0.31
▸ SMN1; SMN2 Q16637 2/20 0.31
▸ NPC1 O15118 1/20 0.31
▸ TSHR P16473 1/20 0.31
▸ RAB9A P51151 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL10370639 0.83 ACHE (0.44) CYP3A4MAPTSMN1; SMN2NPC1TSHR
SCHEMBL27619534 0.80 KMT2A (0.33) ARMEN1KMT2ASMN1; SMN2NPC1
SCHEMBL11576553 0.74 CYP1A2 (0.42) CYP1A2KMT2ASMN1; SMN2TSHRALDH1A1
SCHEMBL7015786 0.74 ALDH1A1 (0.44) MAPTMEN1KMT2ASMN1; SMN2TSHR
SCHEMBL6220822 0.74 ACHE (0.46) MAPTKMT2ASMN1; SMN2TSHRRAB9A
SCHEMBL4950654 0.74 HTR1A (0.50) HTR1AHTR3ACYP1A2CYP3A4MAPT
SCHEMBL31666386 0.74 HTR1A (0.50) HTR1AHTR3ACYP1A2CYP3A4MAPT
SCHEMBL13672486 0.73 KDM4E (0.40) HTR1AMAPTKMT2ASMN1; SMN2NPC1
SCHEMBL13990704 0.73 KDM4E (0.42) CYP1A2CYP2C19MAPTMEN1KMT2A
SCHEMBL10645049 0.73 KDM4E (0.39) AR

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 166 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-117326997-A Polythiol compound, composition for optical material, and preparation method and application thereof 益丰新材料股份有限公司 2024-01-02 — — CN claimed
CN-102618021-B The purposes of molding compounds LANXESS DEUTSCHLAND GMBH (DE) 2016-05-11 — — CN claimed
CN-117326997-A Polythiol compound, composition for optical material, and preparation method and application thereof 益丰新材料股份有限公司 2024-01-02 — — CN disclosed
CN-116640361-B Release agent composition and application thereof 益丰新材料股份有限公司 2023-12-22 — — CN disclosed
CN-116768847-A Thiol composition and application thereof in optical material 益丰新材料股份有限公司 2023-09-19 — — CN disclosed
CN-116640361-A Release agent composition and application thereof 益丰新材料股份有限公司 2023-08-25 — — CN disclosed
CN-103476764-B Process for producing episulfide compound ASAHI KASEI KABUSHIKI KAISHA (JP) 2016-05-25 — — CN disclosed
CN-105602222-A Flame retardant fibre-matrix semifinished products LANXESS DEUTSCHLAND GMBH 2016-05-25 — — CN disclosed
CN-102618021-B The purposes of molding compounds LANXESS DEUTSCHLAND GMBH (DE) 2016-05-11 — — CN disclosed
CN-102791771-B Curable resin composition MITSUBISHI GAS CHEMICAL CO 2014-12-10 — — CN disclosed
CN-102575040-B Novel crystalline foam HUNTSMAN INT LLC 2014-11-26 — — CN disclosed
EP-0240459-A1 Curable compositions CIBA-GEIGY AG (CH) 1987-10-07 — — EP disclosed
EP-0232225-A2 Epoxy resin composition CIBA-GEIGY AG (CH) 1987-08-12 — — EP disclosed
EP-0146498-B1 HARDENABLE COMPOSITION CONTAINING AN EPOXY RESIN, AN IMIDE AND A HARDENING CATALYST CIBA-GEIGY AG (CH) 1987-04-08 — — EP disclosed
EP-0187121-A1 Heat-curable epoxy resin compositions CIBA-GEIGY AG (CH) 1986-07-09 — — EP disclosed
EP-0159288-A2 Process for preparing water-dilutable resins and their application as coating compositions CIBA-GEIGY AG (CH) 1985-10-23 — — EP disclosed
EP-0146498-A2 Hardenable composition containing an epoxy resin, an imide and a hardening catalyst CIBA-GEIGY AG (CH) 1985-06-26 — — EP disclosed
EP-0138769-A2 Diurethane-diureas and use CIBA-GEIGY AG (CH) 1985-04-24 — — EP disclosed
EP-0114150-A2 Curable epoxy resin mixtures CIBA-GEIGY AG (CH) 1984-07-25 — — EP disclosed
EP-0114151-A2 Curable epoxy resin mixtures comprising imide compounds and condensation products from phenols, amines and aldehydes or ketones CIBA-GEIGY AG (CH) 1984-07-25 — — EP disclosed
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