SCHEMBL6062941

SCHEMBL6062941

CN(C)Cc1ccccc1.Cc1c(O)cccc1N(C)C

nearest known ligand 0.55

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
TSHR P16473 2/20 0.55
ALDH1A1 P00352 1/20 0.55
TAAR1 Q96RJ0 1/20 0.44
AOC3 Q16853 1/20 0.39
KDM4E B2RXH2 2/20 0.39
GAA P10253 1/20 0.39
MAPT P10636 1/20 0.39
HSD17B2 P37059 1/20 0.38
TRPM8 Q7Z2W7 1/20 0.38
NPC1 O15118 2/20 0.38
RAB9A P51151 2/20 0.38
HSP90AA1 P07900 1/20 0.38
NR3C1 P04150 1/20 0.38
PGR P06401 1/20 0.38
NR3C2 P08235 1/20 0.38
AR P10275 1/20 0.38
CA12 O43570 1/20 0.38
CA9 Q16790 1/20 0.38
MEN1 O00255 1/20 0.37
KMT2A Q03164 1/20 0.37

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL28939012 0.83 TSHR (0.59) TSHRALDH1A1TAAR1AOC3KDM4E
SCHEMBL673431 0.82 TRPA1 (0.52) TSHRALDH1A1KDM4EGAAMAPT
Phenol SCHEMBL29160642 0.81 TRPA1 (0.43) TSHRALDH1A1KDM4EGAAMAPT
Boric Acid SCHEMBL4657395 0.77 TRPA1 (0.46) TSHRALDH1A1KDM4EGAAMAPT
SCHEMBL11726274 0.76 ALDH1A1 (0.47) TSHRALDH1A1AOC3KDM4EMAPT
Methyl Alcohol SCHEMBL2647148 0.74 TSHR (0.90) TSHRALDH1A1TAAR1AOC3NPC1
SCHEMBL24735547 0.74 TSHR (1.00) TSHRALDH1A1TAAR1AOC3NPC1
SCHEMBL27766437 0.74 TSHR (1.00) TSHRALDH1A1TAAR1AOC3NPC1
SCHEMBL5014268 0.74 TSHR (1.00) TSHRALDH1A1TAAR1AOC3NPC1
SCHEMBL15900 0.74 TSHR (1.00) TSHRALDH1A1TAAR1AOC3NPC1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 10 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-7041771-B1 comprises thermosetting epoxy resin, crosslinking agent (such as methylhexahydrophthalic anhydride) for removing oxide coatings, and tin octanoate catalyst; for electrically connecting metal bond sites in electronics KAC HOLDINGS, INC. (US) 2006-05-09 US disclosed
EP-0843894-B1 ENCAPSULANT WITH FLUXING PROPERTIES AND METHOD OF USE KAC HOLDINGS INC (US) 2005-03-30 EP disclosed
US-6819004-B2 ENCAPSULATED WITH EPOXY RESIN; FLUID FLOW KAC HOLDINGS, INC. 2004-11-16 US disclosed
US-20030175521-A1 Encapsulated with epoxy resin; fluid flow KAC HOLDING, INC. 2003-09-18 US disclosed
US-20030176599-A1 Using an encapsulant-forming thermosetting resin (an epoxy resin) and an anhydride as crosslinker for the resin, crosslinks with resin that acts as a fluxing agent for soldering KESTER, INC. 2003-09-18 US disclosed
EP-0843894-A4 ENCAPSULANT WITH FLUXING PROPERTIES AND METHOD OF USE KIRSTEN KENNETH J (US) 2000-04-26 EP disclosed
EP-0870329-A1 EPOXY RESIN BASED SOLDER PASTE Kirsten, Kenneth, J. (US) 1998-10-14 EP disclosed
EP-0843894-A1 ENCAPSULANT WITH FLUXING PROPERTIES AND METHOD OF USE Kirsten, Kenneth, J. (US) 1998-05-27 EP disclosed
WO-1997007541-A1 ENCAPSULANT WITH FLUXING PROPERTIES AND METHOD OF USE KIRSTEN KENNETH J (US) 1997-02-27 WO disclosed
WO-1997007542-A1 EPOXY RESIN BASED SOLDER PASTE KIRSTEN KENNETH J (US) 1997-02-27 WO disclosed