SCHEMBL6124086

SCHEMBL6124086

CS(=O)(=O)O/N=C(\c1ccc(C#N)cc1)c1nc2ccccc2s1

nearest known ligand 0.51

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
▸ MAPT P10636 10/20 0.51
▸ MEN1 O00255 8/20 0.51
▸ KMT2A Q03164 8/20 0.51
▸ SMN1; SMN2 Q16637 4/20 0.51
▸ ALDH1A1 P00352 6/20 0.46
▸ PDE10A Q9Y233 1/20 0.46
▸ NPC1 O15118 3/20 0.45
▸ RAB9A P51151 3/20 0.45
▸ TSHR P16473 3/20 0.45
▸ CRHBP P24387 1/20 0.45
▸ CRHR2 Q13324 1/20 0.45
▸ THRB P10828 1/20 0.44
▸ RECQL P46063 1/20 0.44
▸ HTT P42858 4/20 0.41
▸ LMNA P02545 3/20 0.41
▸ ALOX15 P16050 1/20 0.40
▸ CASP1 P29466 1/20 0.40
▸ POLB P06746 1/20 0.40
▸ GALK1 P51570 2/20 0.38
▸ TP53 P04637 1/20 0.38

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL6124088 0.87 ALDH1A1 (0.49) MAPTMEN1KMT2ASMN1; SMN2ALDH1A1
SCHEMBL10227044 0.86 MAPT (0.52) MAPTMEN1KMT2ASMN1; SMN2ALDH1A1
SCHEMBL6124090 0.85 MAPT (0.45) MAPTMEN1KMT2ASMN1; SMN2ALDH1A1
SCHEMBL6124085 0.81 SCD (0.49) MAPTMEN1KMT2ASMN1; SMN2ALDH1A1
SCHEMBL6124076 0.80 RECQL (0.55) MAPTMEN1KMT2ASMN1; SMN2ALDH1A1
SCHEMBL6124089 0.74 GLO1 (0.44) MAPTMEN1KMT2ASMN1; SMN2ALDH1A1
SCHEMBL6124087 0.74 ALDH1A1 (0.43) MAPTMEN1KMT2ASMN1; SMN2ALDH1A1
SCHEMBL6127764 0.72 KDM4E (0.45) MAPTMEN1KMT2ASMN1; SMN2ALDH1A1
SCHEMBL18648020 0.72 KDM4E (0.45) MAPTMEN1KMT2ASMN1; SMN2ALDH1A1
SCHEMBL10227050 0.71 ALDH1A1 (0.44) MAPTMEN1KMT2ASMN1; SMN2ALDH1A1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 16 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-9929376-B2 Laminate, kit for manufacturing organic semiconductor, and resist composition for manufacturing organic semiconductor FUJIFILM CORPORATION (JP) 2018-03-27 — — US disclosed
US-9929376-B2 Laminate, kit for manufacturing organic semiconductor, and resist composition for manufacturing organic semiconductor FUJIFILM CORPORATION (JP) 2018-03-27 — — US disclosed
US-9746771-B2 Laminate body FUJIFILM CORPORATION (JP) 2017-08-29 — — US disclosed
US-9746771-B2 Laminate body FUJIFILM CORPORATION (JP) 2017-08-29 — — US disclosed
US-9601706-B2 Resin composition for forming protective film, protective film, pattern forming method, method for manufacturing electronic device, and electronic device FUJIFILM CORPORATION (JP) 2017-03-21 — — US disclosed
US-9601706-B2 Resin composition for forming protective film, protective film, pattern forming method, method for manufacturing electronic device, and electronic device FUJIFILM CORPORATION (JP) 2017-03-21 — — US disclosed
US-20160240816-A1 LAMINATE, KIT FOR MANUFACTURING ORGANIC SEMICONDUCTOR, AND RESIST COMPOSITION FOR MANUFACTURING ORGANIC SEMICONDUCTOR FUJIFILM CORPORATION (JP) 2016-08-18 — — US disclosed
US-20160240816-A1 LAMINATE, KIT FOR MANUFACTURING ORGANIC SEMICONDUCTOR, AND RESIST COMPOSITION FOR MANUFACTURING ORGANIC SEMICONDUCTOR FUJIFILM CORPORATION (JP) 2016-08-18 — — US disclosed
US-20160170303-A1 LAMINATE BODY FUJIFILM CORPORATION (JP) 2016-06-16 — — US disclosed
US-20160170303-A1 LAMINATE BODY FUJIFILM CORPORATION (JP) 2016-06-16 — — US disclosed
US-20150221881-A1 RESIN COMPOSITION FOR FORMING PROTECTIVE FILM, PROTECTIVE FILM, PATTERN FORMING METHOD, METHOD FOR MANUFACTURING ELECTRONIC DEVICE, AND ELECTRONIC DEVICE FUJIFILM CORPORATION (JP) 2015-08-06 — — US disclosed
US-20150221881-A1 RESIN COMPOSITION FOR FORMING PROTECTIVE FILM, PROTECTIVE FILM, PATTERN FORMING METHOD, METHOD FOR MANUFACTURING ELECTRONIC DEVICE, AND ELECTRONIC DEVICE FUJIFILM CORPORATION (JP) 2015-08-06 — — US disclosed
US-8628907-B2 Positive photosensitive resin composition, method for forming cured film, cured film, organic el display device and liquid crystal display device FUJIFILM CORPORATION (JP) 2014-01-14 — — US disclosed
US-8628907-B2 Positive photosensitive resin composition, method for forming cured film, cured film, organic el display device and liquid crystal display device FUJIFILM CORPORATION (JP) 2014-01-14 — — US disclosed
US-20120107563-A1 PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCING PATTERN, MEMS STRUCTURE, METHOD FOR PRODUCING THE STRUCTURE, METHOD FOR DRY ETCHING, METHOD FOR WET ETCHING, MEMS SHUTTER DEVICE, AND IMAGE DISPLAY APPARATUS FUJIFILM CORPORATION (JP) 2012-05-03 — — US disclosed
US-20120045616-A1 POSITIVE PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR FORMING CURED FILM, CURED FILM, ORGANIC EL DISPLAY DEVICE AND LIQUID CRYSTAL DISPLAY DEVICE FUJIFILM CORPORATION (JP) 2012-02-23 — — US disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (1 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-20120045616-A1 POSITIVE PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR FORMING CURED FILM, CURED FILM, ORGANIC EL DISPLAY DEVICE AND LIQUID CRYSTAL DISPLAY DEVICE PELP1, EED, ARCN1 MAPT 1510/4885MEN1 4568/4885KMT2A 915/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.

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