⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL9478066 | 0.82 | QPCT (0.35) | — | |
| SCHEMBL10620381 | 0.80 | — | — | |
| SCHEMBL81085 | 0.77 | ALDH1A1 (0.36) | — | |
| SCHEMBL15917807 | 0.70 | — | — | |
| SCHEMBL273629 | 0.69 | — | — | |
| SCHEMBL10364645 | 0.68 | CYP26A1 (0.37) | — | |
| SCHEMBL26111243 | 0.68 | ALDH1A1 (0.36) | — | |
| Iodide SCHEMBL5531813 | 0.68 | ALDH1A1 (0.36) | — | |
| SCHEMBL9477079 | 0.67 | ALDH1A1 (0.46) | — | |
| SCHEMBL28615774 | 0.67 | CYP26A1 (0.36) | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 162 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| WO-2022117389-A1 | METHOD FOR PRODUCING A TERMINAL-FUNCTIONAL POLYMER | BASF SE (DE) | 2022-06-09 | — | — | WO | claimed |
| EP-0858725-B1 | MULTILAYER PRINTED CIRCUIT BOARD AND PROCESS FOR PRODUCING THE SAME | SUMITOMO BAKELITE CO (JP) | 2000-07-05 | — | — | EP | claimed |
| US-5756190-A | NOVOLAK EPOXY RESIN, CURING AGENT, DILUENT, PHOTOPOLYMERIZATION CATALYST | SUMITOMO BAKELITE COMPANY LIMITED (JP) | 1998-05-26 | — | — | US | claimed |
| US-5244939-A | Improved adhesion | SOMAR CORPORATION (JP) | 1993-09-14 | — | — | US | claimed |
| EP-0454027-A2 | Adhesive for inner lining hose of water tube | SUNSTAR GIKEN KABUSHIKI KAISHA (JP) | 1991-10-30 | — | — | EP | claimed |
| CN-114072444-B | Curable composition, cured product, overcoat film, flexible wiring board, and method for producing same | 日保丽公司 | 2024-07-09 | — | — | CN | disclosed |
| EP-3395848-B1 | POLYURETHANE, CURABLE COMPOSITION, OVERCOAT FILM, AND FLEXIBLE WIRING BOARD AND PRODUCTION METHOD THEREFORE | NIPPON POLYTECH CORP (JP) | 2024-02-28 | — | — | EP | disclosed |
| CN-114080408-B | Cured product, overcoat film, and flexible wiring board | 日保丽公司 | 2023-08-25 | — | — | CN | disclosed |
| CN-114174355-B | Acrylic rubber, crosslinkable rubber composition, and rubber cured product | 电化株式会社 | 2023-08-22 | — | — | CN | disclosed |
| CN-114096579-B | Polyurethane and curable composition | 日保丽公司 | 2023-06-09 | — | — | CN | disclosed |
| WO-2023286767-A1 | THERMOCONDUCTIVE MATERIAL COMPOSITION | 株式会社大阪ソーダ | 2023-01-19 | — | — | WO | disclosed |
| WO-2022117389-A1 | METHOD FOR PRODUCING A TERMINAL-FUNCTIONAL POLYMER | BASF SE (DE) | 2022-06-09 | — | — | WO | disclosed |
| US-5437822-A | Polyetherurethane copolymer | ASAHI GLASS COMPANY LTD. (JP) | 1995-08-01 | — | — | US | disclosed |
| EP-0651040-A1 | Liquid adhesive for electronic parts and process for forming insulating adhesive layer using the same | TOMOEGAWA PAPER CO. LTD. (JP) | 1995-05-03 | — | — | EP | disclosed |
| EP-0649893-A1 | Adhesive tape for electronic parts and liquid adhesive | TOMOEGAWA PAPER CO. LTD. (JP) | 1995-04-26 | — | — | EP | disclosed |
| EP-0649892-A1 | Adhesive tape for electronic parts and liquid adhesive | TOMOEGAWA PAPER CO. LTD. (JP) | 1995-04-26 | — | — | EP | disclosed |
| EP-0553848-A2 | Method for producing a skin-formed polyurethane foam molded product | ASAHI GLASS COMPANY LTD. (JP) | 1993-08-04 | — | — | EP | disclosed |
| EP-0454027-A2 | Adhesive for inner lining hose of water tube | SUNSTAR GIKEN KABUSHIKI KAISHA (JP) | 1991-10-30 | — | — | EP | disclosed |
| US-5034494-A | Bisphenol epoxy resin and a curing component of an epoxy modified aromatic polyamine and a liquid imidazole | SUNSTAR GIKEN KABUSHIKI KAISHA (JP) | 1991-07-23 | — | — | US | disclosed |
| EP-0421389-A2 | Imidazole compound-containing hardening agent composition, method of preparing the same and thermosetting epoxy resin composition | SOMAR CORPORATION (JP) | 1991-04-10 | — | — | EP | disclosed |