SCHEMBL81085

SCHEMBL81085

Cc1nccn1C(C)C#N

nearest known ligand 0.49

Predicted protein targets (top 10)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 1/20 0.36
POLB P06746 1/20 0.36
KMT2A Q03164 1/20 0.36
TSHR P16473 1/20 0.31
FDPS P14324 1/20 0.31
CYP2E1 P05181 1/20 0.31
CYP3A4 P08684 1/20 0.31
CYP2A6 P11509 1/20 0.31
LMNA P02545 1/20 0.30
L3MBTL1 Q9Y468 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL7165333 0.80 ALDH1A1 (0.40) ALDH1A1POLBKMT2ACYP3A4L3MBTL1
SCHEMBL444096 0.78 SMN1; SMN2 (0.36) ALDH1A1
SCHEMBL811490 0.77 MYC (0.37) ALDH1A1POLBLMNAL3MBTL1
SCHEMBL1695811 0.77 MYC (0.37) ALDH1A1POLBLMNAL3MBTL1
SCHEMBL626669 0.77
SCHEMBL273629 0.76
SCHEMBL10771449 0.76 ALDH1A1 (0.37) ALDH1A1POLBKMT2ACYP3A4
SCHEMBL28241666 0.76 MAPT (0.32) TSHR
SCHEMBL84081 0.75 BRD4 (0.41) ALDH1A1KMT2A
Hydrogen Sulfide SCHEMBL28846015 0.74 BRD4 (0.40) ALDH1A1KMT2A

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Appears in 4914 patents — a generic fragment claimed broadly, so it's down-weighted as IP noise. Top by claim status then date:

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-120005486-A Low dielectric resin composition 南亚塑胶工业股份有限公司 2025-05-16 CN claimed
CN-119751418-A Method for preparing 2, 4-diamino-6- [2- (2-methyl-1-imidazole) ethyl ] -1,3, 5-triazine 道生天合材料科技(上海)股份有限公司 2025-04-04 CN claimed
CN-119708811-A Boron nitride-containing resin composition and application thereof 陕西生益科技有限公司 2025-03-28 CN claimed
CN-119708761-A Epoxy resin composition and application thereof 陕西生益科技有限公司 2025-03-28 CN claimed
CN-119708812-A Resin composition, metal foil-clad laminate and application thereof 陕西生益科技有限公司 2025-03-28 CN claimed
US-20250102099-A1 LONG POT LIFE CURABLE EPOXY SYSTEM FOR CURED-IN-PLACE PIPE REHABILITATION PROCESS BLUE CUBE IP LLC 2025-03-27 US claimed
CN-119613921-A Resin composition and application thereof 陕西生益科技有限公司 2025-03-14 CN claimed
CN-119542538-A Electrolyte, preparation method thereof and lithium ion battery 惠州亿纬动力电池有限公司 2025-02-28 CN claimed
CN-119505830-A Insulating heat-conducting material, preparation method and application thereof, radiator and power assembly 深圳市汇川技术股份有限公司 2025-02-25 CN claimed
CN-119463119-A Curing agent composition, thermosetting resin composition and application thereof 陕西生益科技有限公司 2025-02-18 CN claimed
US-5112989-A Process for producing unsaturated mono and dicarboxylic acid imide compound MATSUSHITA ELECTRIC WORKS LTD. (JP) 1992-05-12 US claimed
EP-0387381-A1 Process for producing unsaturated dicarboxylic acid imide compound MATSUSHITA ELECTRIC WORKS, LTD. (JP) 1990-09-19 EP claimed
US-4689388-A POLYHYDRAZIDE, LATENT CURING AGENT, DICYANDIAMIDE, IMIDAZOLE OR DERIVATIVE AJINOMOTO CO., INC. (JP) 1987-08-25 US claimed
US-4658009-A Novel 2-substituted-4,6-diamino-s-triazine/isocyanuric acid adduct, process for synthesis of said adduct and process for curing polyepoxy resin with said adduct SHIKOKU CHEMICALS CORPORATION (JP) 1987-04-14 US claimed
EP-0194895-A2 2-substituted-4, 6-diamino-s-triazine/isocyanuric acid adduct, process for synthesis of said adduct and process for curing polyepoxy resin with said adduct SHIKOKU CHEMICALS CORPORATION (JP) 1986-09-17 EP claimed
US-4370467-A CYANATE, PEROXIDE MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 1983-01-25 US claimed
US-4304818-A POLYISOCYANURATE-OXAZOLIDONES FROM POLYISOCYANATE AND POLYEPOXIDE HITACHI, LTD. (JP) 1981-12-08 US claimed
US-4110364-A AND BISMALEIIMIDES MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 1978-08-29 US claimed
US-4107098-A HALOMETHYOXIRANE IS REACTED WITH AN IMIDAZOLE COMPOUND-PRODUCT REACTED WITH POLYFUNCTIONAL EPOXY COMPOUND MITSUBISHI PETROCHEMICAL COMPANY LIMITED (JP) 1978-08-15 US claimed
US-4026872-A PHENOLIC CURING AGENTS HITACHI, LTD. (JA) 1977-05-31 US claimed