SCHEMBL6276301

SCHEMBL6276301

CC(N)OC(=O)CCC(=O)OC(C)N

nearest known ligand 0.41

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
LMNA P02545 6/20 0.41
TSHR P16473 4/20 0.41
GABRP O00591 2/20 0.39
GABRD O14764 2/20 0.39
GABRA1 P14867 2/20 0.39
GABRB1 P18505 2/20 0.39
GABRG2 P18507 2/20 0.39
GABRB3 P28472 2/20 0.39
GABRA5 P31644 2/20 0.39
GABRA3 P34903 2/20 0.39
GABRA2 P47869 2/20 0.39
GABRB2 P47870 2/20 0.39
GABRA4 P48169 2/20 0.39
GABRE P78334 2/20 0.39
GABRA6 Q16445 2/20 0.39
GABRG1 Q8N1C3 2/20 0.39
GABRG3 Q99928 2/20 0.39
GABRQ Q9UN88 2/20 0.39
KDM4E B2RXH2 1/20 0.34
MAPT P10636 3/20 0.34

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL27814479 0.91 GABRP (0.48) LMNATSHRGABRPGABRDGABRA1
SCHEMBL22412975 0.90 LMNA (0.48) LMNATSHRGABRPGABRDGABRA1
SCHEMBL27713949 0.87 LMNA (0.57) LMNATSHRMAPTMAPK1CYP2C9
SCHEMBL11412667 0.87
SCHEMBL27637567 0.85 CYP2D6 (0.37) LMNATSHRGABRPGABRDGABRA1
SCHEMBL13538450 0.84 LMNA (0.59) LMNATSHRMAPTMAPK1CYP2C9
SCHEMBL6281673 0.83 MGAM (0.38) LMNATSHRGABRPGABRDGABRA1
SCHEMBL10930838 0.82 LMNA (0.68) LMNATSHRMAPTMAPK1CYP2C9
SCHEMBL5173210 0.81
SCHEMBL4671535 0.81

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 38 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-109055026-A A kind of maintenance washes agent and maintenance washes method for selective wave-soldering nozzle 广州华望汽车电子有限公司 2018-12-21 CN claimed
CN-104476007-B A kind of high-melting point lead-free halogen-free soldering tin paste and preparation method thereof DONGGUAN YONG AN TECHNOLOGY CO., LTD. (CN) 2015-10-28 CN claimed
CN-104476007-A High-melting-point lead-free and halogen-free soldering paste and preparing method of high-melting-point lead-free and halogen-free soldering paste DONGGUAN YONG AN TECHNOLOGY CO LTD 2015-04-01 CN claimed
CN-1301173-C Return soldering method SUKA TADATOMO (JP) 2007-02-21 CN claimed
US-6887319-B2 Solder powder mixed with flux; vaporization in presence of solvent; thixotropic agent; storage stability SENJU METAL INDUSTRY CO., LTD. (JP) 2005-05-03 US claimed
US-20040000355-A1 Residue-free solder paste SUGA, TADATOMO (JP) 2004-01-01 US claimed
CN-1451504-A Return soldering method TADATOMO SUKA (JP) 2003-10-29 CN claimed
CN-115305133-A Lubricating type electrostatic spraying anti-rust oil composition and preparation method and application thereof 中国石油化工股份有限公司 2022-11-08 CN disclosed
EP-3938045-A1 SALTS OF A ISOCHROMANYL COMPOUND AND CRYSTALLINE FORMS, PROCESSES FOR PREPARING, THERAPEUTIC USES, AND PHARMACEUTICAL COMPOSITIONS THEREOF Sunovion Pharmaceuticals Inc. (US) 2022-01-19 EP disclosed
CN-109055026-B Maintenance cleaning agent and maintenance cleaning method for selective wave-soldering nozzle 广州华望汽车电子有限公司 2020-10-23 CN disclosed
WO-2020186165-A1 SALTS OF A ISOCHROMANYL COMPOUND AND CRYSTALLINE FORMS, PROCESSES FOR PREPARING, THERAPEUTIC USES, AND PHARMACEUTICAL COMPOSITIONS THEREOF SUNOVION PHARMACEUTICALS INC. (US) 2020-09-17 WO disclosed
CN-109909638-A Soldering paste with good collapse resistance and preparation method thereof 中山翰荣新材料有限公司 2019-06-21 CN disclosed
CN-109055026-A A kind of maintenance washes agent and maintenance washes method for selective wave-soldering nozzle 广州华望汽车电子有限公司 2018-12-21 CN disclosed
CN-1768959-A Carbon deposit cleaning agent and its application in reproduction of carbon deposit deactivation catalyst CHINA PETROLEUM & CHEMICAL (CN) 2006-05-10 CN disclosed
CN-1768956-A Carbon deposit cleaning agent and its application in reproduction process of deactivation catalyst CHINA PETROLEUM & CHEMICAL (CN) 2006-05-10 CN disclosed
US-6935553-B2 Reflow soldering method SENJU METAL INDUSTRY CO., LTD. (JP) 2005-08-30 US disclosed
US-6887319-B2 Solder powder mixed with flux; vaporization in presence of solvent; thixotropic agent; storage stability SENJU METAL INDUSTRY CO., LTD. (JP) 2005-05-03 US disclosed
US-20040007610-A1 Reflow soldering method SENJU METAL INDUSTRY CO., LTD. (JP) 2004-01-15 US disclosed
US-20040000355-A1 Residue-free solder paste SUGA, TADATOMO (JP) 2004-01-01 US disclosed
CN-1451504-A Return soldering method TADATOMO SUKA (JP) 2003-10-29 CN disclosed