SCHEMBL6281673

SCHEMBL6281673

CC(N)OC(=O)CC(=O)OC(C)N

nearest known ligand 0.38

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
MGAM O43451 2/20 0.38
GAA P10253 2/20 0.38
SI P14410 2/20 0.38
MGAM2 Q2M2H8 2/20 0.38
TSHR P16473 5/20 0.35
LMNA P02545 4/20 0.33
GABRP O00591 2/20 0.33
GABRD O14764 2/20 0.33
GABRA1 P14867 2/20 0.33
GABRB1 P18505 2/20 0.33
GABRG2 P18507 2/20 0.33
GABRB3 P28472 2/20 0.33
GABRA5 P31644 2/20 0.33
GABRA3 P34903 2/20 0.33
GABRA2 P47869 2/20 0.33
GABRB2 P47870 2/20 0.33
GABRA4 P48169 2/20 0.33
GABRE P78334 2/20 0.33
GABRA6 Q16445 2/20 0.33
GABRG1 Q8N1C3 2/20 0.33

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL6276301 0.83 LMNA (0.41) TSHRLMNAGABRPGABRDGABRA1
SCHEMBL5173210 0.81
SCHEMBL4671535 0.81
SCHEMBL3286044 0.81
SCHEMBL29205810 0.79 MMP1 (0.54) SLC7A5MMP1MMP2MMP3MMP9
SCHEMBL22412975 0.79 LMNA (0.48) TSHRLMNAGABRPGABRDGABRA1
SCHEMBL3635104 0.79
SCHEMBL11429984 0.79 LMNA (0.31) TSHRLMNAGABRPGABRDGABRA1
SCHEMBL59545 0.79
SCHEMBL11412667 0.77

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 9 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-109055026-A A kind of maintenance washes agent and maintenance washes method for selective wave-soldering nozzle 广州华望汽车电子有限公司 2018-12-21 CN claimed
US-6887319-B2 Solder powder mixed with flux; vaporization in presence of solvent; thixotropic agent; storage stability SENJU METAL INDUSTRY CO., LTD. (JP) 2005-05-03 US claimed
US-20040000355-A1 Residue-free solder paste SUGA, TADATOMO (JP) 2004-01-01 US claimed
CN-109055026-B Maintenance cleaning agent and maintenance cleaning method for selective wave-soldering nozzle 广州华望汽车电子有限公司 2020-10-23 CN disclosed
CN-109055026-A A kind of maintenance washes agent and maintenance washes method for selective wave-soldering nozzle 广州华望汽车电子有限公司 2018-12-21 CN disclosed
CN-102069315-B Unleaded halogen-free soldering paste with high wettability UNIV SICHUAN 2012-11-21 CN disclosed
CN-102069315-A Unleaded halogen-free soldering paste with high wettability UNIV SICHUAN 2011-05-25 CN disclosed
US-6887319-B2 Solder powder mixed with flux; vaporization in presence of solvent; thixotropic agent; storage stability SENJU METAL INDUSTRY CO., LTD. (JP) 2005-05-03 US disclosed
US-20040000355-A1 Residue-free solder paste SUGA, TADATOMO (JP) 2004-01-01 US disclosed