Predicted protein targets (top 5)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | CYP2C9 | P11712 | 1/20 | 0.36 |
| ▸ | L3MBTL1 | Q9Y468 | 1/20 | 0.34 |
| ▸ | EPHX2 | P34913 | 3/20 | 0.32 |
| ▸ | HSD11B1 | P28845 | 1/20 | 0.32 |
| ▸ | EPHX1 | P07099 | 1/20 | 0.30 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL6456147 | 0.72 | CYP2C9 (0.41) | CYP2C9EPHX2HSD11B1EPHX1 | |
| SCHEMBL26709231 | 0.68 | CYP2C9 (0.38) | CYP2C9EPHX2HSD11B1EPHX1 | |
| SCHEMBL2196303 | 0.67 | HSD11B1 (0.38) | L3MBTL1EPHX2HSD11B1EPHX1 | |
| SCHEMBL2982997 | 0.67 | CYP2C9 (0.41) | CYP2C9EPHX2HSD11B1 | |
| SCHEMBL18639010 | 0.67 | CYP2C9 (0.32) | CYP2C9 | |
| SCHEMBL4412291 | 0.66 | CYP2C9 (0.45) | CYP2C9L3MBTL1EPHX2HSD11B1 | |
| SCHEMBL4067305 | 0.66 | CYP2C9 (0.38) | CYP2C9EPHX2EPHX1 | |
| SCHEMBL12193712 | 0.65 | CYP2C9 (0.35) | CYP2C9EPHX2 | |
| SCHEMBL2410122 | 0.64 | L3MBTL1 (0.32) | L3MBTL1EPHX2 | |
| SCHEMBL10239375 | 0.63 | CYP2C9 (0.38) | CYP2C9EPHX2 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 2 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-6974658-B2 | HIGH MOLECULAR COMPOUND, MONOMER COMPOUNDS AND PHOTOSENSITIVE COMPOSITION FOR PHOTORESIST, PATTERN FORMING METHOD UTILIZING PHOTOSENSITIVE COMPOSITION, AND METHOD OF MANUFACTURING ELECTRONIC COMPONENTS | KABUSHIKI KAISHA TOSHIBA (JP) | 2005-12-13 | — | — | US | disclosed |
| US-20030235781-A1 | High molecular compound, monomer compounds and photosensitive composition for photoresist, pattern forming method utilizing photosensitive composition, and method of manufacturing electronic components | KABUSHIKI KAISHA TOSHIBA (JP) | 2003-12-25 | — | — | US | disclosed |