SCHEMBL6373232

SCHEMBL6373232

Cc1ccc2nc(-c3ccccc3)[nH]c2c1C

nearest known ligand 0.54

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
NPC1 O15118 4/20 0.49
RAB9A P51151 4/20 0.49
GAA P10253 3/20 0.49
POLB P06746 1/20 0.46
KDM4E B2RXH2 4/20 0.45
ALDH1A1 P00352 4/20 0.45
HPGD P15428 4/20 0.45
TP53 P04637 4/20 0.45
SMN1; SMN2 Q16637 3/20 0.45
HSD17B10 Q99714 3/20 0.45
TSHR P16473 2/20 0.45
NFKB1 P19838 2/20 0.45
NFKB2 Q00653 2/20 0.45
RELA Q04206 2/20 0.45
MAPT P10636 5/20 0.45
MEN1 O00255 2/20 0.45
KMT2A Q03164 2/20 0.45
CYP3A4 P08684 2/20 0.45
GLA P06280 1/20 0.45
HTT P42858 1/20 0.45

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL6333668 0.83 ALDH1A1 (0.53) NPC1RAB9AGAAPOLBKDM4E
SCHEMBL4788936 0.82 GAA (0.55) NPC1RAB9AGAAKDM4EALDH1A1
SCHEMBL6368201 0.81 NPC1 (0.55) NPC1RAB9AGAAPOLBKDM4E
SCHEMBL6885366 0.80 NPC1 (0.61) NPC1RAB9AGAAPOLBKDM4E
SCHEMBL10351016 0.78 CBFB (0.61) NPC1RAB9AGAAKDM4EALDH1A1
SCHEMBL6322779 0.77 MMP2 (0.60) NPC1RAB9AGAAPOLBALDH1A1
SCHEMBL5056430 0.76 NPC1 (0.69) NPC1RAB9AGAAPOLBKDM4E
SCHEMBL4188971 0.76 TRPV1 (0.41) NPC1RAB9AGAA
SCHEMBL5203546 0.76 ADORA2B (0.41) NPC1RAB9AGAAALDH1A1HPGD
SCHEMBL28462055 0.75 CA1 (0.44) NPC1RAB9AGAAKDM4EALDH1A1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 14 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-0562187-B1 Process for production of copper through-hole printed wiring boards SANWA LAB LTD (JP) 1996-01-10 EP claimed
US-5275694-A Printed circuits with copper through holes, negative patterns, photoresists, lamination, dipping and etching SANWA LABORATORY LTD. (JP) 1994-01-04 US claimed
EP-0562187-A1 Process for production of copper through-hole printed wiring boards SANWA LABORATORY LTD. (JP) 1993-09-29 EP claimed
EP-0428260-A2 Metal surface treatment agents SANWA LABORATORY LTD. (JP) 1991-05-22 EP claimed
CN-103755642-B The synthetic method of 2-aryl benzoglyoxaline CHENGDU UNIVERSITY OF TECHNOLOGY (CN) 2015-09-30 CN disclosed
CN-103755642-A Synthetic method of 2-aryl benzimidazole UNIV CHENGDU TECHNOLOGY 2014-04-30 CN disclosed
CN-1654709-A Surface treatment agents for metal films of printed circuit boards TAMURA KAKEN CORP (JP) 2005-08-17 CN disclosed
US-20050173678-A1 Surface treatment agents for metal films of printed circuit boards TAMURA KAKEN CORPORATION (JP) 2005-08-11 US disclosed
US-6712262-B2 BENZIMIDAZOLE AND IODINE COMPOUNDS TAMURAKAKEN CORPORATION (JP) 2004-03-30 US disclosed
US-20030141351-A1 Water-soluble preflux, printed circuit board, and process for treating the surface of a metal in a printed circuit board TAMURA CORPORATION (JP) 2003-07-31 US disclosed
EP-0562187-B1 Process for production of copper through-hole printed wiring boards SANWA LAB LTD (JP) 1996-01-10 EP disclosed
US-5275694-A Printed circuits with copper through holes, negative patterns, photoresists, lamination, dipping and etching SANWA LABORATORY LTD. (JP) 1994-01-04 US disclosed
EP-0562187-A1 Process for production of copper through-hole printed wiring boards SANWA LABORATORY LTD. (JP) 1993-09-29 EP disclosed
EP-0428260-A2 Metal surface treatment agents SANWA LABORATORY LTD. (JP) 1991-05-22 EP disclosed