SCHEMBL6426573

SCHEMBL6426573

CC(CC(=O)O)C(C)(C)C1(C(=O)OC(C)(C)C)OO1

nearest known ligand 0.33

Predicted protein targets (top 1)

geneUniProtsupporting neighboursconfidence
PGD P52209 1/20 0.33

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL714488 0.87 CYP2D6 (0.39)
SCHEMBL5531023 0.80 SLC22A6 (0.31) PGD
SCHEMBL2025020 0.70 CTSL (0.32)
SCHEMBL2351263 0.69 PGD (0.35) PGD
SCHEMBL7181932 0.69 PGD (0.35) PGD
SCHEMBL2705280 0.69 PGD (0.35) PGD
SCHEMBL17512932 0.67 DGAT1 (0.30)
SCHEMBL23913764 0.65 SLC22A6 (0.41) PGD
SCHEMBL20711453 0.65 SLC22A6 (0.41) PGD
SCHEMBL1572820 0.65 SLC22A6 (0.41) PGD

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 5 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-114430751-A Thermosetting composition, method for producing molded article using same, and cured product 出光兴产株式会社 2022-05-03 CN disclosed
CN-114316839-A Anisotropic conductive connecting material and method for mounting electronic component using anisotropic conductive connecting material 太阳油墨制造株式会社 2022-04-12 CN disclosed
US-6939614-B2 Image-fixing member, image-fixing apparatus and image-forming apparatus using the same RICOH COMPANY, LTD. (JP) 2005-09-06 US disclosed
US-20040033431-A1 Image-fixing member, image-fixing apparatus and image-forming apparatus using the same RICOH COMPANY, LTD. (JP) 2004-02-19 US disclosed
US-5710234-A POLYORTHOESTERS FOR MOLDING MATERIALS, ADHESIVES AND HEAT RESISTANT POLYMERS NIPPON STEEL CHEMICAL CO., LTD. (JP) 1998-01-20 US disclosed