SCHEMBL6433575

SCHEMBL6433575

CC(C)O[Si](C)(OC(C)C)c1ccc(Br)cc1

nearest known ligand 0.35

Predicted protein targets (top 8)

geneUniProtsupporting neighboursconfidence
CYP2A6 P11509 1/20 0.35
ALDH1A1 P00352 3/20 0.33
NPC1 O15118 1/20 0.32
HTT P42858 1/20 0.32
RAB9A P51151 1/20 0.32
SMN1; SMN2 Q16637 1/20 0.32
MAPT P10636 1/20 0.32
MAOA P21397 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL705977 0.89
SCHEMBL12576136 0.80 CYP2A6 (0.36) CYP2A6ALDH1A1HTTSMN1; SMN2MAPT
SCHEMBL27743555 0.78 ESR1 (0.45) ALDH1A1NPC1RAB9AMAPT
SCHEMBL6433033 0.78 CYP1A2 (0.31)
SCHEMBL309052 0.77 ESR1 (0.37) ALDH1A1SMN1; SMN2
SCHEMBL6433577 0.75 CYP2A6 (0.32) CYP2A6ALDH1A1MAPTMAOA
SCHEMBL6433976 0.75 CYP2A6 (0.40) CYP2A6ALDH1A1NPC1RAB9ASMN1; SMN2
SCHEMBL28615627 0.74
SCHEMBL6436935 0.74 ALDH1A1 (0.42) ALDH1A1
SCHEMBL10539487 0.73 CYP2A6 (0.38) CYP2A6ALDH1A1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 5 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-1276807-B1 CURABLE SILICONE RESIN COMPOSITION AND REACTIVE SILICON COMPOUNDS DOW CORNING (US) 2005-10-12 EP disclosed
US-6780471-B2 USING CROSSLINKER WITH NONFLEXIBLE LINKAGE INCLUDING AT LEAST ONE P-ARYLENE MOIETY FOR SPATIAL SEPARATION; FLEXURAL STRENGTH, FRACTURE TOUGHNESS, MODULUS AND/OR MECHANICAL DAMPING DOW CORNING CORPORATION 2004-08-24 US disclosed
US-20030130389-A1 Curable silicone resin composition and reactive silicon compounds DOW CORNING LIMITED (GB) 2003-07-10 US disclosed
EP-1276807-A1 CURABLE SILICONE RESIN COMPOSITION AND REACTIVE SILICON COMPOUNDS Dow Corning Corporation (US) 2003-01-22 EP disclosed
WO-2001083608-A1 CURABLE SILICONE RESIN COMPOSITION AND REACTIVE SILICON COMPOUNDS DOW CORNING CORPORATION (US) 2001-11-08 WO disclosed