Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | TP53 | P04637 | 3/20 | 0.32 |
| ▸ | CYP3A4 | P08684 | 3/20 | 0.32 |
| ▸ | MAPK1 | P28482 | 3/20 | 0.32 |
| ▸ | HIF1A | Q16665 | 2/20 | 0.32 |
| ▸ | LMNA | P02545 | 2/20 | 0.32 |
| ▸ | CYP1A2 | P05177 | 2/20 | 0.32 |
| ▸ | SMN1; SMN2 | Q16637 | 2/20 | 0.32 |
| ▸ | NPC1 | O15118 | 2/20 | 0.32 |
| ▸ | RAB9A | P51151 | 2/20 | 0.32 |
| ▸ | MEN1 | O00255 | 2/20 | 0.32 |
| ▸ | KMT2A | Q03164 | 2/20 | 0.32 |
| ▸ | NFKB1 | P19838 | 1/20 | 0.32 |
| ▸ | THPO | P40225 | 1/20 | 0.32 |
| ▸ | PPM1B | O75688 | 1/20 | 0.32 |
| ▸ | PTPN1 | P18031 | 1/20 | 0.32 |
| ▸ | PPP1CC | P36873 | 1/20 | 0.32 |
| ▸ | TFPI2 | P48307 | 1/20 | 0.32 |
| ▸ | PPP5C | P53041 | 1/20 | 0.32 |
| ▸ | PPP2CA | P67775 | 1/20 | 0.32 |
| ▸ | PPP1CA | P62136 | 1/20 | 0.32 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL16389767 | 0.81 | MEN1 (0.33) | TP53CYP3A4MAPK1HIF1ALMNA | |
| SCHEMBL9016948 | 0.72 | TP53 (0.31) | TP53CYP3A4MAPK1HIF1ALMNA | |
| SCHEMBL9619070 | 0.67 | FFAR3 (0.32) | — | |
| SCHEMBL231600 | 0.67 | LMNA (0.36) | LMNATSHR | |
| SCHEMBL3157012 | 0.67 | LMNA (0.36) | LMNATSHR | |
| SCHEMBL1305216 | 0.66 | TP53 (0.39) | TP53CYP3A4MAPK1HIF1ALMNA | |
| SCHEMBL10715854 | 0.65 | SLC1A2 (0.40) | TP53MAPK1HIF1ALMNACYP1A2 | |
| SCHEMBL23364672 | 0.65 | SLC1A2 (0.42) | TP53MAPK1HIF1ALMNACYP1A2 | |
| SCHEMBL12699306 | 0.62 | SLC1A2 (0.39) | LMNAMEN1KMT2AMAPTTSHR | |
| SCHEMBL25851784 | 0.62 | SLC1A2 (0.39) | LMNAMEN1KMT2AMAPTTSHR |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 19 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-113396173-B | Epoxy resin solution | 尤尼吉可株式会社 | 2023-09-12 | — | — | CN | disclosed |
| US-11753500-B2 | Epoxy resin solution | UNITIKA LTD. (JP) | 2023-09-12 | — | — | US | disclosed |
| EP-3919541-B1 | EPOXY RESIN SOLUTION | UNITIKA LTD (JP) | 2023-06-21 | — | — | EP | disclosed |
| EP-3919541-A1 | EPOXY RESIN SOLUTION | Unitika Ltd. (JP) | 2021-12-08 | — | — | EP | disclosed |
| CN-113396173-A | Epoxy resin solution | 尤尼吉可株式会社 | 2021-09-14 | — | — | CN | disclosed |
| CN-108291014-B | Polyarylate resin, process for producing the same, and polyarylate resin composition | 尤尼吉可株式会社 | 2021-03-19 | — | — | CN | disclosed |
| CN-106661197-B | Resin composition and laminate using same | 尤尼吉可株式会社 | 2020-05-12 | — | — | CN | disclosed |
| EP-2097483-B1 | CURABLE SILICONE COMPOSITION | DOW CORNING TORAY SILICONE (JP) | 2014-08-20 | — | — | EP | disclosed |
| CN-103819881-A | Resin composition for insulation, insulating thin film, prepreg, and printed circuit substrate | SAMSUNG ELECTRO MECH | 2014-05-28 | — | — | CN | disclosed |
| CN-101616994-B | Curable silicone composition | DOW CORNING TORAY CO LTD JP | 2012-05-16 | — | — | CN | disclosed |
| US-8119744-B2 | Curable silicone composition | DOW CORNING TORAY CO., LTD. (JP) | 2012-02-21 | — | — | US | disclosed |
| US-7976975-B2 | Battery device and electronic apparatus | SEIKO EPSON CORPORATION (JP) | 2011-07-12 | — | — | US | disclosed |
| US-20100140537-A1 | Curable Silicone Composition | DOW CORNING TORAY CO., LTD. (JP) | 2010-06-10 | — | — | US | disclosed |
| CN-101616994-A | Curable silicone composition | DOW CORNING TORAY CO LTD | 2009-12-30 | — | — | CN | disclosed |
| EP-2097483-A1 | CURABLE SILICONE COMPOSITION | Dow Corning Toray Silicone Company, Ltd. (JP) | 2009-09-09 | — | — | EP | disclosed |
| WO-2008078662-A1 | CURABLE SILICONE COMPOSITION | DOW CORNING TORAY CO., LTD. (JP) | 2008-07-03 | — | — | WO | disclosed |
| US-20080057355-A1 | BATTERY DEVICE AND ELECTRONIC APPARATUS | SEIKO EPSON CORPORATION (JP) | 2008-03-06 | — | — | US | disclosed |
| CN-1465607-A | Epoxy resin, epoxy resin composition and solidified epoxy resin and preparation method thereof | ������������ʽ���� | 2004-01-07 | — | — | CN | disclosed |
| CN-1136324-A | Photosolder resist ink, printed circuit board, and process for producing the same | GOO CHEMICAL CO LTD (JP) | 1996-11-20 | — | — | CN | disclosed |