Predicted protein targets (top 3)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | LMNA | P02545 | 1/20 | 0.36 |
| ▸ | TSHR | P16473 | 1/20 | 0.36 |
| ▸ | HSD11B1 | P28845 | 2/20 | 0.31 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL231600 | 1.00 | LMNA (0.36) | LMNATSHRHSD11B1 | |
| SCHEMBL9016948 | 0.94 | TP53 (0.31) | LMNATSHR | |
| SCHEMBL1481003 | 0.71 | TP53 (0.36) | LMNATSHR | |
| SCHEMBL8621964 | 0.71 | TP53 (0.32) | LMNATSHR | |
| SCHEMBL19433874 | 0.69 | HSD11B1 (0.37) | LMNATSHRHSD11B1 | |
| SCHEMBL25218266 | 0.67 | GRM4 (0.38) | LMNATSHRHSD11B1 | |
| SCHEMBL14536263 | 0.67 | HSD11B1 (0.36) | LMNATSHRHSD11B1 | |
| SCHEMBL643447 | 0.67 | TP53 (0.32) | LMNATSHR | |
| SCHEMBL11362509 | 0.67 | GAA (0.33) | — | |
| SCHEMBL8621959 | 0.67 | MAPK1 (0.33) | LMNATSHR |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-8703010-B2 | Curing agent for epoxy resins and epoxy resin compositions | MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) | 2014-04-22 | — | — | US | disclosed |
| EP-1754734-B1 | CURING AGENT FOR EPOXY RESINS AND EPOXY RESIN COMPOSITIONS | MITSUBISHI GAS CHEMICAL CO (JP) | 2010-03-10 | — | — | EP | disclosed |
| US-20080306223-A1 | Curing Agent for Epoxy Resins and Epoxy Resin Compositions | OKOSHI ATSUSHI | 2008-12-11 | — | — | US | disclosed |
| EP-1754734-A1 | CURING AGENT FOR EPOXY RESINS AND EPOXY RESIN COMPOSITIONS | MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) | 2007-02-21 | — | — | EP | disclosed |